Inventor · disambiguated record
Tokio Takei
Also filed as: TAKEI TOKIO
6 granted patents·2 pending applications·275 citations·filing 1990–2006
87Inventor score
Top patents by PatentIndex Score
8 records- 0191US7727860B2Method for manufacturing bonded wafer and outer-peripheral grinding machine of bonded waferSHINETSU HANDOTAI KK·Filed 2006·Granted Jun 1, 2010·21 cites·22 claims
- 0287US6583029B2Production method for silicon wafer and SOI wafer, and SOI waferSHINETSU HANDOTAI KK·Filed 2001·Granted Jun 24, 2003·60 cites·23 claims
- 0376US5071785AMethod for preparing a substrate for forming semiconductor devices by bonding warped wafersSHINETSU HANDOTAI KK·Filed 1990·Granted Dec 10, 1991·64 cites·5 claims
- 0474US5340435ABonded wafer and method of manufacturing itITO YATSUO·Filed 1993·Granted Aug 23, 1994·69 cites·7 claims
- 0571US5938512AWafer holding jigSHINETSU HANDOTAI KK·Filed 1997·Granted Aug 17, 1999·33 cites·9 claims
- 0661US6110391AMethod of manufacturing a bonding substrateSHINETSU HANDOTAI KK·Filed 1997·Granted Aug 29, 2000·28 cites·15 claims
- 0741US2008315349A1Method for Manufacturing Bonded Wafer and Bonded WaferSHINETSU HANDOTAI KK·Filed 2005·Application pending·0 cites
- 0840US2009233109A1Method for Producing Bonded Wafer, Bonded Wafer, and Surface Grinding MachineSHIN ETSU HANDOTAI CO LDT·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →