Inventor · disambiguated record
Kibby B. Horsford
Also filed as: HORSFORD KIBBY B · HORSFORD KIBBY BARTH · HORSFORD Kibby
10 granted patents·1 pending application·184 citations·filing 1993–2017
89Inventor score
Top patents by PatentIndex Score
11 records- 0187US5523696AMethod and apparatus for testing integrated circuit chipsIBM·Filed 1993·Granted Jun 4, 1996·64 cites·7 claims
- 0286US5528159AMethod and apparatus for testing integrated circuit chipsIBM·Filed 1995·Granted Jun 18, 1996·63 cites·10 claims
- 0378US7670437B2Mask and substrate alignment for solder bump processIBM·Filed 2008·Granted Mar 2, 2010·8 cites·21 claims
- 0468US5672980AMethod and apparatus for testing integrated circuit chipsIBM·Filed 1996·Granted Sep 30, 1997·26 cites·2 claims
- 0564US6603195B1Planarized plastic package modules for integrated circuitsIBM·Filed 2000·Granted Aug 5, 2003·15 cites·16 claims
- 0654US10304763B2Producing wafer level packaging using leadframe strip and related deviceGLOBALFOUNDRIES INC·Filed 2017·Granted May 28, 2019·0 cites·20 claims
- 0751US9892999B2Producing wafer level packaging using leadframe strip and related deviceGLOBALFOUNDRIES INC·Filed 2016·Granted Feb 13, 2018·0 cites·14 claims
- 0842US9496234B1Wafer-level chip-scale package structure utilizing conductive polymerGLOBALFOUNDRIES INC·Filed 2015·Granted Nov 15, 2016·0 cites·9 claims
- 0941US5659256AMethod and apparatus for testing integrated circuit chipsIBM·Filed 1996·Granted Aug 19, 1997·8 cites·3 claims
- 1035US7410919B2Mask and substrate alignment for solder bump processIBM·Filed 2003·Granted Aug 12, 2008·0 cites·33 claims
- 1135US2017271285A1Integrated circuit package using polymer-solder ball structures and forming methodsGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
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