Inventor · disambiguated record
Tzu-Bin Lin
Also filed as: LIN TZU-BIN
2 granted patents·4 pending applications·13 citations·filing 2004–2005
50Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0161US7005749B2Flip chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Feb 28, 2006·13 cites·15 claims
- 0238US7498202B2Method for die attachingADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 3, 2009·0 cites·15 claims
- 0335US2005139974A1Chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 0435US2005140005A1Chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 0535US2005139994A1Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 0633US2007045863A1Package structure and fabrication process thereofHSIEH YA-YU·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tzu-Bin Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →