Inventor · disambiguated record
Wan-Huei Lu
Also filed as: LU WAN-HUEI
1 granted patent·1 pending application·12 citations·filing 2006–2006
34Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0176US7432188B2Structure of bumps forming on an under metallurgy layer and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Oct 7, 2008·12 cites·9 claims
- 0233US2007134905A1Method for mounting bumps on an under metallurgy layerTSAI CHI-LONG·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wan-Huei Lu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →