Inventor · disambiguated record
Wen-Liang Yeh
Also filed as: YEH WEN-LIANG
6 granted patents·5 pending applications·14 citations·filing 2002–2022
73Inventor score
Files withUNIMICRON TECHNOLOGY CORP9
Top patents by PatentIndex Score
11 records- 0191US10461146B1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Oct 29, 2019·10 cites·10 claims
- 0284US10660202B1Carrier structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted May 19, 2020·4 cites·14 claims
- 0361US11348869B2Method of manufacturing chip packaging structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted May 31, 2022·0 cites·7 claims
- 0459US2021219435A1Manufacturing method of circuit carrier boardUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 0554US10999939B2Circuit carrier board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted May 4, 2021·0 cites·5 claims
- 0654US10879167B2Chip packaging structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Dec 29, 2020·0 cites·9 claims
- 0751US2022287182A1Embedded component structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 0845US11201123B2Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Dec 14, 2021·0 cites·5 claims
- 0945US2019380200A1Embedded component structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
- 1039US2003205624A1Differentiable card and fabrication method thereofFiled 2002·Application pending·0 cites
- 1135US2003205623A1Method of manufacturing a card with anti-counterfeit differentiable markFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →