Inventor · disambiguated record
Irving Memis
Also filed as: MEMIS IRVING
35 granted patents·915 citations·filing 1975–2010
98Inventor score
Top patents by PatentIndex Score
35 records- 0196US6664485B2Full additive process with filled plated through holesIBM·Filed 2001·Granted Dec 16, 2003·66 cites·19 claims
- 0294US5847929AAttaching heat sinks directly to flip chips and ceramic chip carriersIBM·Filed 1996·Granted Dec 8, 1998·164 cites·16 claims
- 0392US6069023AAttaching heat sinks directly to flip chips and ceramic chip carriersIBM·Filed 1998·Granted May 30, 2000·115 cites·46 claims
- 0491US6251707B1Attaching heat sinks directly to flip chips and ceramic chip carriersIBM·Filed 2000·Granted Jun 26, 2001·63 cites·5 claims
- 0590US7470990B2Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Dec 30, 2008·16 cites·15 claims
- 0688US7791897B2Multi-layer embedded capacitance and resistance substrate coreENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Sep 7, 2010·15 cites·14 claims
- 0785US7119003B2Extension of fatigue life for C4 solder ball to chip connectionIBM·Filed 2005·Granted Oct 10, 2006·14 cites·19 claims
- 0883US6418616B2Full additive process with filled plated through holesIBM·Filed 2001·Granted Jul 16, 2002·24 cites·5 claims
- 0982US7294791B2Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Nov 13, 2007·30 cites·10 claims
- 1081US7589283B2Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling systemENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Sep 15, 2009·12 cites·19 claims
- 1180US6195883B1Full additive process with filled plated through holesIBM·Filed 1998·Granted Mar 6, 2001·37 cites·3 claims
- 1280US6162997ACircuit board with primary and secondary through holesIBM·Filed 1997·Granted Dec 19, 2000·64 cites·11 claims
- 1379US7416972B2Method of making same low moisture absorptive circuitized substrave with reduced thermal expansionENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Aug 26, 2008·6 cites·4 claims
- 1479US6650016B1Selective C4 connection in IC packagingIBM·Filed 2002·Granted Nov 18, 2003·23 cites·13 claims
- 1578US7454833B2High performance chip carrier substrateIBM·Filed 2007·Granted Nov 25, 2008·6 cites·7 claims
- 1676US6391210B2Process for manufacturing a multi-layer circuit boardIBM·Filed 2001·Granted May 21, 2002·17 cites·21 claims
- 1773US7622384B2Method of making multi-chip electronic package with reduced line skewENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Nov 24, 2009·4 cites·4 claims
- 1872US7332818B2Multi-chip electronic package with reduced line skew and circuitized substrate for use thereinENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Feb 19, 2008·4 cites·9 claims
- 1971US5532024AMethod for improving the adhesion of polymeric adhesives to nickel surfacesIBM·Filed 1995·Granted Jul 2, 1996·36 cites·17 claims
- 2071US5189261AElectrical and/or thermal interconnections and methods for obtaining suchIBM·Filed 1990·Granted Feb 23, 1993·52 cites·9 claims
- 2170US4233620ASealing of integrated circuit modulesIBM·Filed 1979·Granted Nov 11, 1980·29 cites·22 claims
- 2266US8144480B2Multi-layer embedded capacitance and resistance substrate coreDAS RABINDRA N·Filed 2010·Granted Mar 27, 2012·2 cites·6 claims
- 2366US7279798B2High wireability microvia substrateIBM·Filed 2005·Granted Oct 9, 2007·2 cites·19 claims
- 2465US7863526B2High performance chip carrier substrateIBM·Filed 2008·Granted Jan 4, 2011·2 cites·18 claims
- 2564US7214886B2High performance chip carrier substrateIBM·Filed 2003·Granted May 8, 2007·7 cites·3 claims
- 2664US4048356AHermetic topsealant coating and process for its formationIBM·Filed 1975·Granted Sep 13, 1977·21 cites·13 claims
- 2763US7145221B2Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Dec 5, 2006·10 cites·34 claims
- 2861US6965170B2High wireability microvia substrateIBM·Filed 2003·Granted Nov 15, 2005·7 cites·8 claims
- 2960US5965944APrinted circuit boards for mounting a semiconductor integrated circuit dieIBM·Filed 1997·Granted Oct 12, 1999·27 cites·17 claims
- 3053US6919635B2High density microvia substrate with high wireabilityIBM·Filed 2003·Granted Jul 19, 2005·4 cites·30 claims
- 3152US7886435B2High performance chip carrier substrateIBM·Filed 2008·Granted Feb 15, 2011·0 cites·4 claims
- 3248US5414928AMethod of making an electronic package assembly with protective encapsulant materialIBM·Filed 1993·Granted May 16, 1995·21 cites·9 claims
- 3341US6290860B1Process for design and manufacture of fine line circuits on planarized thin film dielectrics and circuits manufactured therebyIBM·Filed 1999·Granted Sep 18, 2001·7 cites·19 claims
- 3439US7067916B2Extension of fatigue life for C4 solder ball to chip connectionIBM·Filed 2001·Granted Jun 27, 2006·0 cites·19 claims
- 3533US4971894AMethod and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layerIBM·Filed 1989·Granted Nov 20, 1990·8 cites·5 claims
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