Inventor · disambiguated record
Seishiro Yamakawa
Also filed as: YAMAKAWA SEISHIRO
4 granted patents·147 citations·filing 1991–1993
81Inventor score
Files withMATSUSHITA ELECTRIC WORKS LTD4
Top patents by PatentIndex Score
4 records- 0189US5284807AGlass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing materialMATSUSHITA ELECTRIC WORKS LTD·Filed 1992·Granted Feb 8, 1994·70 cites·7 claims
- 0283US5407872AGlass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing materialMATSUSHITA ELECTRIC WORKS LTD·Filed 1993·Granted Apr 18, 1995·44 cites·7 claims
- 0360US5275878AComposite dielectric and printed-circuit use substrate utilizing the sameMATSUSHITA ELECTRIC WORKS LTD·Filed 1991·Granted Jan 4, 1994·23 cites·7 claims
- 0448US5334645ASubstrate for circuit board including the glass fibers as reinforcing materialMATSUSHITA ELECTRIC WORKS LTD·Filed 1993·Granted Aug 2, 1994·10 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Seishiro Yamakawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →