Inventor · disambiguated record
Ilya Hecht
Also filed as: HECHT ILYA
2 granted patents·1 pending application·137 citations·filing 2007–2007
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0194US7936062B2Wafer level chip packagingTESSERA TECH IRELAND LTD·Filed 2007·Granted May 3, 2011·75 cites·23 claims
- 0293US7807508B2Wafer-level fabrication of lidded chips with electrodeposited dielectric coatingTESSERA TECH HUNGARY KFT·Filed 2007·Granted Oct 5, 2010·62 cites·21 claims
- 0340US2007190747A1Wafer level packaging to lidded chipsTESSERA TECH HUNGARY KFT·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →