Inventor · disambiguated record
Mei Yih Goh
Also filed as: GOH MEI YIH
1 granted patent·3 pending applications·0 citations·filing 2020–2024
13Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG4
Top patents by PatentIndex Score
4 records- 0162US2023051100A1Semiconductor package having a lead frame and a clip frameINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0255US11515244B2Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufactureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 29, 2022·0 cites·11 claims
- 0355US2025054842A1Package with concave wettability and/or metallization layerINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0450US2025096082A1Interconnect clip for vertically stacked die arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →