Inventor · disambiguated record
Tseng-Yao Pan
Also filed as: PAN TSENG-YAO
3 granted patents·1 pending application·0 citations·filing 2021–2024
43Inventor score
Technology areasH10P
Files withWINBOND ELECTRONICS CORP4
Top patents by PatentIndex Score
4 records- 0168US11978768B2Manufacturing method of semiconductor structureWINBOND ELECTRONICS CORP·Filed 2023·Granted May 7, 2024·0 cites·14 claims
- 0263US11721720B2Semiconductor structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Aug 8, 2023·0 cites·7 claims
- 0354US2025072081A1Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0446US12027422B2Semiconductor structures and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jul 2, 2024·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Tseng-Yao Pan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →