Inventor · disambiguated record
Min-Chen Lin
Also filed as: LIN MIN-CHEN
7 granted patents·1 pending application·26 citations·filing 2013–2021
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0192US10847869B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2018·Granted Nov 24, 2020·9 cites·23 claims
- 0291US8916972B2Adhesion between post-passivation interconnect structure and polymerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 23, 2014·15 cites·20 claims
- 0373US10128192B2Fan-out package structureMEDIATEK INC·Filed 2017·Granted Nov 13, 2018·2 cites·15 claims
- 0470US11688728B2Integrated circuit structure and method for reducing polymer layer delaminationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·19 claims
- 0564US11721882B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2020·Granted Aug 8, 2023·0 cites·14 claims
- 0654US11081475B2Integrated circuit structure and method for reducing polymer layer delaminationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 3, 2021·0 cites·20 claims
- 0754US9583424B2Integrated circuit structure and method for reducing polymer layer delaminationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·20 claims
- 0841US2019355697A1Electronic package for high-data rate communication applicationsMEDIATEK INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →