Inventor · disambiguated record
Hye Seong Kim
Also filed as: KIM HYE SEONG
6 granted patents·3 pending applications·3 citations·filing 2012–2021
69Inventor score
Top patents by PatentIndex Score
9 records- 0174US9218909B2Multi-layered ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 22, 2015·2 cites·12 claims
- 0267US9424989B2Embedded multilayer ceramic electronic component and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 23, 2016·1 cites·4 claims
- 0365USRE49747EMultilayer ceramic electronic component to be embedded in board, manufacturing method thereof, and printed circuit board having multilayer ceramic electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 5, 2023·0 cites·23 claims
- 0455US9384896B2Multilayer ceramic electronic component to be embedded in board, manufacturing method thereof, and printed circuit board having multilayer ceramic electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 5, 2016·0 cites·23 claims
- 0545US2014063684A1Conductive paste composition for external electrode, multilayered ceramic component including the same and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 0643US9847172B2Embedded device, and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Dec 19, 2017·0 cites·15 claims
- 0743US2013148261A1Conductive paste for external electrode, multilayer ceramic electronic component using the same, and method of manufacturing the sameKIM HYE SEONG·Filed 2012·Application pending·0 cites
- 0837US10028373B2Heat radiating member and printed circuit board including sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 17, 2018·0 cites·7 claims
- 0932US2017135196A1Heat dissipation member and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hye Seong Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →