Inventor · disambiguated record
Carl Raleigh
Also filed as: RALEIGH CARL · RALEIGH CARL J · RALEIGH CARL JAMES
11 granted patents·717 citations·filing 1990–2013
93Inventor score
Top patents by PatentIndex Score
11 records- 0195US5186383AMethod for forming solder bump interconnections to a solder-plated circuit traceMOTOROLA INC·Filed 1991·Granted Feb 16, 1993·152 cites·10 claims
- 0293US5751552ASemiconductor device balancing thermal expansion coefficient mismatchMOTOROLA INC·Filed 1997·Granted May 12, 1998·160 cites·19 claims
- 0393US5269453ALow temperature method for forming solder bump interconnections to a plated circuit traceMOTOROLA INC·Filed 1992·Granted Dec 14, 1993·180 cites·14 claims
- 0489US8692366B2Apparatus and method for microelectromechanical systems device packagingXUE XIAOJIE·Filed 2011·Granted Apr 8, 2014·9 cites·34 claims
- 0588US5154341ANoncollapsing multisolder interconnectionMOTOROLA INC·Filed 1990·Granted Oct 13, 1992·107 cites·4 claims
- 0687US8624380B2Vertical mount package for MEMS sensorsXUE XIAOJIE·Filed 2012·Granted Jan 7, 2014·6 cites·11 claims
- 0777US5086966APalladium-coated solder ballMOTOROLA INC·Filed 1990·Granted Feb 11, 1992·41 cites·5 claims
- 0875US8174111B2Vertical mount package for MEMS sensorsXUE XIAOJIE·Filed 2009·Granted May 8, 2012·6 cites·11 claims
- 0969US5233504ANoncollapsing multisolder interconnectionMOTOROLA INC·Filed 1992·Granted Aug 3, 1993·43 cites·4 claims
- 1059US9249010B2Electrical shielding in a MEMS leadframe packageANALOG DEVICES INC·Filed 2013·Granted Feb 2, 2016·2 cites·17 claims
- 1138US6300167B1Semiconductor device with flame sprayed heat spreading layer and methodMOTOROLA INC·Filed 1994·Granted Oct 9, 2001·11 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →