Inventor · disambiguated record
Ken Sakata
Also filed as: SAKATA KEN
4 granted patents·6 pending applications·230 citations·filing 2003–2007
82Inventor score
Files withMITSUI MINING & SMELTING CO10
Top patents by PatentIndex Score
10 records- 0196US7255919B2Mold release layer transferring film and laminate filmMITSUI MINING & SMELTING CO·Filed 2003·Granted Aug 14, 2007·111 cites·16 claims
- 0295US7173322B2COF flexible printed wiring board and method of producing the wiring boardMITSUI MINING & SMELTING CO·Filed 2003·Granted Feb 6, 2007·93 cites·9 claims
- 0382US7198989B2Method of producing a COF flexible printed wiring boardMITSUI MINING & SMELTING CO·Filed 2005·Granted Apr 3, 2007·8 cites·16 claims
- 0474US6900989B2Flexible printed wiring board with semiconductor chip and releasing layerMITSUI MINING & SMELTING CO·Filed 2003·Granted May 31, 2005·18 cites·15 claims
- 0557US2008251947A1Cof flexible printed wiring board and semiconductor deviceMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 0651US2008171138A1Process For Producing A Printed Wiring BoardMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 0747US2005274689A1Printed wiring board, production process thereof and semiconductor deviceMITSUI MINING & SMELTING CO·Filed 2005·Application pending·0 cites
- 0843US2005205972A1COF flexible printed wiring board and semiconductor deviceMITSUI MINING & SMELTING CO·Filed 2005·Application pending·0 cites
- 0938US2006214282A1Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor deviceMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 1037US2006213684A1Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor deviceMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →