Inventor · disambiguated record
Boxi Liu
Also filed as: LIU BOXI
1 granted patent·6 pending applications·11 citations·filing 2015–2024
33Inventor score
Top patents by PatentIndex Score
7 records- 0189US10580717B2Multiple-chip package with multiple thermal interface materialsINTEL CORP·Filed 2016·Granted Mar 3, 2020·11 cites·19 claims
- 0246US2018342463A1Conductive adhesive layer for semiconductor devices and packagesINTEL CORP·Filed 2018·Application pending·0 cites
- 0343US2018190593A1Conductive adhesive layer for semiconductor devices and packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 0442US2025039096A1Data transmission parameter adjusting method and related apparatusTENCENT TECH SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 0540US2024223505A1Data transmission method, related apparatus, device, and storage mediumTENCENT TECH SHENZHEN COMPANY LTD·Filed 2024·Application pending·0 cites
- 0631US2017066088A1Ball grid array (bga) apparatus and methodsINTEL CORP·Filed 2015·Application pending·0 cites
- 0730US2018323130A1Adhesive polymer thermal interface material with sintered fillers for thermal conductivity in micro-electronic packagingINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →