Inventor · disambiguated record
Kyoungll Huh
Also filed as: HUH KYOUNGLL
2 granted patents·4 citations·filing 2013–2016
49Inventor score
Technology areasH10W
Files withSTATS CHIPPAC LTD2
Top patents by PatentIndex Score
2 records- 0177US10068877B2Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structureSTATS CHIPPAC LTD·Filed 2016·Granted Sep 4, 2018·3 cites·7 claims
- 0259US9349616B2Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structureSTATS CHIPPAC LTD·Filed 2013·Granted May 24, 2016·1 cites·15 claims
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