Inventor · disambiguated record
Thomas James Moutinho
Also filed as: MOUTINHO JR THOMAS · MOUTINHO JR THOMAS J · MOUTINHO THOMAS · MOUTINHO THOMAS J
6 granted patents·5 pending applications·23 citations·filing 1999–2025
76Inventor score
Top patents by PatentIndex Score
11 records- 0190US11148141B2Solid-state, multi-well plate readerCERILLO LLC·Filed 2020·Granted Oct 19, 2021·6 cites·24 claims
- 0277US2025338578A1Device having multiple emitter layersTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0369US12403475B2Solid-state, multi-well plate readerCERILLO LLC·Filed 2021·Granted Sep 2, 2025·0 cites·27 claims
- 0467US2024060026A1Manufacturable co-culture moduleCERILLO INC·Filed 2023·Application pending·0 cites
- 0565US12382684B2Device having multiple emitter layersTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 5, 2025·0 cites·24 claims
- 0655US8324098B2Via and method of forming the via with a substantially planar top surface that is suitable for carbon nanotube applicationsAKLIK MEHMET EMIN·Filed 2010·Granted Dec 4, 2012·2 cites·16 claims
- 0753US2025142851A1Method to suppress base poly linkup overgrowth into the emitter cavity during silicon germanium selective epitaxy growthTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0847US6323129B1Process for maintaining a semiconductor substrate layer deposition equipment chamber in a preconditioned and low particulate stateNAT SEMICONDUCTOR CORP·Filed 1999·Granted Nov 27, 2001·15 cites·14 claims
- 0943US7915093B1System and method for manufacturing an integrated circuit anti-fuse in conjunction with a tungsten plug processNAT SEMICONDUCTOR CORP·Filed 2006·Granted Mar 29, 2011·0 cites·20 claims
- 1039US2011221031A1System and method for manufacturing an integrated circuit anti-fuse in conjunction with a tungsten plug processNAT SEMICONDUCTOR CORP·Filed 2011·Application pending·0 cites
- 1138US2016303283A1Thin film with microchannelsWORCESTER POLYTECH INST·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →