Inventor · disambiguated record
Yoshio Okayama
Also filed as: OKAYAMA YOSHIO
50 granted patents·21 pending applications·228 citations·filing 1997–2024
98Inventor score
Top patents by PatentIndex Score
71 records- 0195US7915737B2Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile deviceSANYO ELECTRIC CO·Filed 2007·Granted Mar 29, 2011·40 cites·5 claims
- 0291US7485967B2Semiconductor device with via hole for electric connectionSANYO ELECTRIC CO·Filed 2006·Granted Feb 3, 2009·20 cites·6 claims
- 0387US8309864B2Device mounting board and manufacturing method therefor, and semiconductor moduleKOBAYASHI HAJIME·Filed 2009·Granted Nov 13, 2012·21 cites·12 claims
- 0487US7732925B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Jun 8, 2010·14 cites·8 claims
- 0585US10927476B2Production method for group III nitride crystalUNIV OSAKA·Filed 2019·Granted Feb 23, 2021·1 cites·11 claims
- 0682US7256497B2Semiconductor device with a barrier layer and a metal layerSANYO ELECTRIC CO·Filed 2005·Granted Aug 14, 2007·9 cites·18 claims
- 0780US10350725B2RAMO4 substrate and manufacturing method thereofPANASONIC IP MAN CO LTD·Filed 2017·Granted Jul 16, 2019·1 cites·10 claims
- 0879US9325257B2Power semiconductor device to reduce voltage variation between terminalsPANASONIC IP MAN CO LTD·Filed 2013·Granted Apr 26, 2016·5 cites·10 claims
- 0979US7492045B2Semiconductor module, method for manufacturing semiconductor modules and mobile deviceSANYO ELECTRIC CO·Filed 2007·Granted Feb 17, 2009·8 cites·13 claims
- 1078US12049710B2Group-III nitride substratePANASONIC HOLDINGS CORP·Filed 2023·Granted Jul 30, 2024·0 cites·7 claims
- 1178US8471289B2Semiconductor laser device, optical pickup device and semiconductor deviceOKAYAMA YOSHIO·Filed 2010·Granted Jun 25, 2013·7 cites·10 claims
- 1278US8278213B2Semiconductor device and manufacturing method of the sameKAMEYAMA KOUJIRO·Filed 2005·Granted Oct 2, 2012·18 cites·9 claims
- 1377US10304740B2RAMO4 monocrystalline substratePANASONIC IP MAN CO LTD·Filed 2017·Granted May 28, 2019·2 cites·6 claims
- 1476US7416963B2Manufacturing method of semiconductor deviceUMEMOTO MITSUO·Filed 2005·Granted Aug 26, 2008·9 cites·14 claims
- 1576US7241679B2Method of manufacturing semiconductor deviceSANYO ELECTRIC CO·Filed 2005·Granted Jul 10, 2007·6 cites·13 claims
- 1676US2024352623A1Group-iii nitride substratePANASONIC HOLDINGS CORP·Filed 2024·Application pending·0 cites
- 1774US7855452B2Semiconductor module, method of manufacturing semiconductor module, and mobile deviceSANYO ELECTRIC CO·Filed 2008·Granted Dec 21, 2010·5 cites·3 claims
- 1874US7759247B2Manufacturing method of semiconductor device with a barrier layer and a metal layerSANYO ELECTRIC CO·Filed 2007·Granted Jul 20, 2010·5 cites·14 claims
- 1971US8338946B2Semiconductor module, method of manufacturing semiconductor module, and mobile deviceYANASE YASUYUKI·Filed 2010·Granted Dec 25, 2012·3 cites·5 claims
- 2071US7750478B2Semiconductor device with via hole of uneven widthSANYO ELECTRIC CO·Filed 2007·Granted Jul 6, 2010·4 cites·10 claims
- 2171US2022119984A1Group iii nitride substrate and method for producing group iii nitride crystalPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 2269US8274148B2Semiconductor moduleYANASE YASUYUKI·Filed 2010·Granted Sep 25, 2012·4 cites·7 claims
- 2369US2025129514A1Method for producing group iii nitride crystalsPANASONIC HOLDINGS CORP·Filed 2024·Application pending·0 cites
- 2467US11713517B2Group-III nitride substratePANASONIC CORP·Filed 2020·Granted Aug 1, 2023·0 cites·5 claims
- 2567US7495881B2Chucking method and processing method using the sameSANYO ELECTRIC CO·Filed 2005·Granted Feb 24, 2009·2 cites·32 claims
- 2667US2024372316A1Light-emitting devicePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 2765US11396716B2Group-III nitride substrate containing carbon at a surface region thereofUNIV OSAKA·Filed 2019·Granted Jul 26, 2022·0 cites·18 claims
- 2863US10246796B2RAMO4 substratePANASONIC IP MAN CO LTD·Filed 2017·Granted Apr 2, 2019·1 cites·5 claims
- 2963US10202710B2Process for producing group III nitride crystal and apparatus for producing group III nitride crystalUNIV OSAKA·Filed 2015·Granted Feb 12, 2019·1 cites·12 claims
- 3062US11248310B2Group III nitride substrate and method for producing group III nitride crystalPANASONIC IP MAN CO LTD·Filed 2017·Granted Feb 15, 2022·0 cites·10 claims
- 3161US11713516B2Group III nitride crystal, group III nitride substrate, and method of manufacturing group III nitride crystalPANASONIC CORP·Filed 2021·Granted Aug 1, 2023·0 cites·8 claims
- 3261US11624128B2Group III nitride crystal, group III nitride substrate, and method of manufacturing group III nitride crystalPANASONIC CORP·Filed 2021·Granted Apr 11, 2023·0 cites·9 claims
- 3361US7989359B2Semiconductor module manufacturing method, semiconductor module, and mobile deviceSANYO ELECTRIC CO·Filed 2008·Granted Aug 2, 2011·2 cites·12 claims
- 3460US8497163B2Method for manufacturing a circuit deviceSANYO ELECTRIC CO·Filed 2012·Granted Jul 30, 2013·1 cites·19 claims
- 3559US6841451B2Method of fabricating semiconductor device having alignment markSANYO ELECTRIC CO·Filed 2002·Granted Jan 11, 2005·7 cites·14 claims
- 3658US9165898B2Method of manufacturing semiconductor device with through holeKAMEYAMA KOJIRO·Filed 2008·Granted Oct 20, 2015·2 cites·11 claims
- 3755US11795573B2Method of manufacturing group III nitride crystal by reacting an oxidizing gas containing nitrogen with a group III element droplet and growing a group III nitride crystal on a seed substrateUNIV OSAKA·Filed 2021·Granted Oct 24, 2023·0 cites·3 claims
- 3854US11377757B2Method for producing group III nitride crystal and seed substratePANASONIC CORP·Filed 2020·Granted Jul 5, 2022·0 cites·9 claims
- 3954US11220759B2Method of manufacturing a group III-nitride crystal comprising a nucleation step, a pyramid growth step, a lateral growth step, and a flat thick film growth stepUNIV OSAKA·Filed 2020·Granted Jan 11, 2022·0 cites·6 claims
- 4051US12282199B2Light emitting device, manufacturing method therefor, and waveguide structurePANASONIC IP MAN CO LTD·Filed 2022·Granted Apr 22, 2025·0 cites·22 claims
- 4151US6916743B2Semiconductor device and method for manufacturing thereofSANYO ELECTRIC CO·Filed 2002·Granted Jul 12, 2005·6 cites·7 claims
- 4250US6831015B1Fabrication method of semiconductor device and abrasive liquid used thereinSANYO ELECTRIC CO·Filed 1997·Granted Dec 14, 2004·15 cites·24 claims
- 4349US9439285B2Device mounting board and semiconductor power moduleSANYO ELECTRIC CO·Filed 2013·Granted Sep 6, 2016·0 cites·19 claims
- 4449US8129846B2Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable deviceYAMAMOTO TETSUYA·Filed 2008·Granted Mar 6, 2012·0 cites·7 claims
- 4549US6995457B2Wiring structure and manufacturing method therefor, semiconductor device including wiring structure and wiring boardSANYO ELECTRIC CO·Filed 2003·Granted Feb 7, 2006·3 cites·5 claims
- 4649US2009168391A1Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the sameSAITOU KOUICHI·Filed 2008·Application pending·0 cites
- 4748US8362611B2Semiconductor module, method for manufacturing semiconductor module, and portable deviceSANYO ELECTRIC CO·Filed 2008·Granted Jan 29, 2013·0 cites·17 claims
- 4848US7172962B2Method of manufacturing a semiconductor deviceSANYO ELECTRIC CO·Filed 2003·Granted Feb 6, 2007·4 cites·20 claims
- 4948US2010025842A1Semiconductor module and semiconductor deviceSANYO ELECTRIC CO·Filed 2009·Application pending·0 cites
- 5047US2022190557A1Light emitting device, manufacturing method, and waveguide structurePANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
Showing the top 50 of 71 patent records by PatentIndex Score.
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