Inventor · disambiguated record
Yungcheol Kong
Also filed as: KONG YUNGCHEOL
7 granted patents·47 citations·filing 2015–2020
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0197US10177188B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 8, 2019·41 cites·17 claims
- 0280US11482554B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·1 cites·11 claims
- 0378US10756055B2Stacked image sensor package and stacked image sensor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·2 cites·19 claims
- 0471US10868073B2Method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 15, 2020·1 cites·18 claims
- 0562US9883593B2Semiconductor modules and semiconductor packagesCHO KYONGSOON·Filed 2015·Granted Jan 30, 2018·2 cites·12 claims
- 0651US10262971B2Stacked image sensor package and stacked image sensor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 16, 2019·0 cites·15 claims
- 0745US11367714B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →