Inventor · disambiguated record
Seah Sun Too
Also filed as: TOO SEAH S · TOO SEAH SUN
20 granted patents·3 pending applications·235 citations·filing 2003–2014
95Inventor score
Top patents by PatentIndex Score
23 records- 0197US9027631B2Metal alloy injection molding overflowsMICROSOFT CORP·Filed 2012·Granted May 12, 2015·17 cites·20 claims
- 0293US8991473B2Metal alloy injection molding protrusionsMICROSOFT CORP·Filed 2014·Granted Mar 31, 2015·18 cites·20 claims
- 0387US7651938B2Void reduction in indium thermal interface materialADVANCED MICRO DEVICES INC·Filed 2006·Granted Jan 26, 2010·15 cites·18 claims
- 0487US7544542B2Reduction of damage to thermal interface material due to asymmetrical loadADVANCED MICRO DEVICES INC·Filed 2006·Granted Jun 9, 2009·16 cites·18 claims
- 0586US6870258B1Fixture suitable for use in coupling a lid to a substrate and methodADVANCED MICRO DEVICES INC·Filed 2003·Granted Mar 22, 2005·42 cites·18 claims
- 0685US6936501B1Semiconductor component and method of manufactureADVANCED MICRO DEVICES INC·Filed 2004·Granted Aug 30, 2005·44 cites·20 claims
- 0784US8497162B1Lid attach processTOO SEAH SUN·Filed 2006·Granted Jul 30, 2013·12 cites·10 claims
- 0883US7999394B2Void reduction in indium thermal interface materialADVANCED MICRO DEVICES INC·Filed 2009·Granted Aug 16, 2011·10 cites·19 claims
- 0983US7513035B2Method of integrated circuit packagingADVANCED MICRO DEVICES INC·Filed 2006·Granted Apr 7, 2009·13 cites·16 claims
- 1081US8865527B2Lid attach processTOO SEAH SUN·Filed 2013·Granted Oct 21, 2014·5 cites·15 claims
- 1176US7633151B2Integrated circuit package lid with a wetting filmADVANCED MICRO DEVICES INC·Filed 2007·Granted Dec 15, 2009·7 cites·42 claims
- 1276US7256067B1LGA fixture for indium assembly processADVANCED MICRO DEVICES INC·Filed 2006·Granted Aug 14, 2007·9 cites·18 claims
- 1371US8378458B2Semiconductor chip with a rounded cornerADVANCED MICRO DEVICES INC·Filed 2010·Granted Feb 19, 2013·3 cites·12 claims
- 1468US8017434B2Semiconductor chip package fixtureADVANCED MICRO DEVICES INC·Filed 2008·Granted Sep 13, 2011·6 cites·26 claims
- 1564US8232138B2Circuit board with notched stiffener frameLIM KEVIN W·Filed 2010·Granted Jul 31, 2012·2 cites·20 claims
- 1663US8733423B1Metal alloy injection molding protrusionsMICROSOFT CORP·Filed 2012·Granted May 27, 2014·0 cites·12 claims
- 1762US7256065B1Methods and fixture for coupling a lid to a support substrateADVANCED MICRO DEVICES INC·Filed 2004·Granted Aug 14, 2007·13 cites·5 claims
- 1852US9205486B2Metal alloy injection moldingMICROSOFT CORP·Filed 2012·Granted Dec 8, 2015·0 cites·19 claims
- 1950US8297986B2Integrated circuit socketTOO SEAH SUN·Filed 2007·Granted Oct 30, 2012·3 cites·28 claims
- 2045US7860599B2Lid attachment mechanismADVANCED MICRO DEVICES INC·Filed 2007·Granted Dec 28, 2010·0 cites·27 claims
- 2144US2014150982A1Metal Alloy Injection TechniquesMICROSOFT CORP·Filed 2012·Application pending·0 cites
- 2242US2009057884A1Multi-Chip PackageTOO SEAH SUN·Filed 2007·Application pending·0 cites
- 2338US2012288996A1Methods and apparatus for applying an adhesive to a circuit boardTOO SEAH S·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →