Inventor · disambiguated record
Michael Kelly
Also filed as: KELLY MICHAEL · KELLY MICHAEL G · KELLY MICHAEL GENE
96 granted patents·10 pending applications·2,527 citations·filing 1975–2025
99Inventor score
Files withAMKOR TECHNOLOGY INC29AMKOR TECH SINGAPORE HOLDING PTE LTD16PLAID INC11AVAGO TECHNOLOGIES GENERAL IP7KELLY MICHAEL G5
Top patents by PatentIndex Score
106 records- 0198US11503010B2Secure permissioning of access to user accounts, including secure deauthorization of access to user accountsPLAID INC·Filed 2020·Granted Nov 15, 2022·11 cites·20 claims
- 0298US11424155B2Semiconductor device package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 0398US10530761B2Secure permissioning of access to user accounts, including secure deauthorization of access to user accountsPLAID TECH INC·Filed 2018·Granted Jan 7, 2020·88 cites·20 claims
- 0498US10523653B2Secure permissioning of access to user accounts, including secure deauthorization of access to user accountsPLAID TECH INC·Filed 2018·Granted Dec 31, 2019·87 cites·15 claims
- 0598US10104059B2Secure permissioning of access to user accounts, including secure deauthorization of access to user accountsPLAID TECH INC·Filed 2016·Granted Oct 16, 2018·103 cites·30 claims
- 0698US10074630B2Semiconductor package with high routing density patchAMKOR TECHNOLOGY INC·Filed 2015·Granted Sep 11, 2018·27 cites·20 claims
- 0798US10003591B2Secure permissioning of access to user accounts, including secure deauthorization of access to user accountsPLAID TECH INC·Filed 2016·Granted Jun 19, 2018·109 cites·14 claims
- 0898US9653428B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted May 16, 2017·132 cites·20 claims
- 0998US9543242B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·73 cites·20 claims
- 1098US6559075B1Method of separating two layers of material from one another and electronic components produced using this processSIEMENS AG·Filed 1999·Granted May 6, 2003·409 cites·28 claims
- 1197US11901335B2Semiconductor package with routing patch and conductive interconnection structures laterally displaced from routing patchAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Feb 13, 2024·2 cites·18 claims
- 1297US11050729B2Secure permissioning of access to user accounts, including secure deauthorization of access to user accountsPLAID INC·Filed 2019·Granted Jun 29, 2021·23 cites·15 claims
- 1397US10904239B2Secure permissioning of access to user accounts, including secure deauthorization of access to user accountsPLAID INC·Filed 2019·Granted Jan 26, 2021·24 cites·20 claims
- 1497US10256114B2Semiconductor device with tiered pillar and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Apr 9, 2019·16 cites·16 claims
- 1597US9349681B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted May 24, 2016·16 cites·20 claims
- 1697US6740604B2Method of separating two layers of material from one anotherSIEMENS AG·Filed 2002·Granted May 25, 2004·144 cites·31 claims
- 1797US6396116B1Integrated circuit packaging for optical sensor devicesAGILENT TECHNOLOGIES INC·Filed 2000·Granted May 28, 2002·200 cites·21 claims
- 1896US11595374B2Secure permissioning of access to user accounts, including secure deauthorization of access to user accountsPLAID INC·Filed 2021·Granted Feb 28, 2023·4 cites·20 claims
- 1996US11289451B2Semiconductor package with high routing density patchAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Mar 29, 2022·3 cites·22 claims
- 2096US10192816B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jan 29, 2019·15 cites·18 claims
- 2196US9966300B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted May 8, 2018·13 cites·20 claims
- 2296US8199518B1Top feature package and methodCHUN JONG OK·Filed 2010·Granted Jun 12, 2012·110 cites·20 claims
- 2396US7341925B2Method for transferring a semiconductor body from a growth substrate to a support materialOSRAM GMBH·Filed 2005·Granted Mar 11, 2008·39 cites·36 claims
- 2495US11120158B2Secure permissioning of access to user accounts, including secure distribution of aggregated user account dataPLAID INC·Filed 2019·Granted Sep 14, 2021·46 cites·21 claims
- 2595US10283400B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted May 7, 2019·11 cites·20 claims
- 2695US8987050B1Method and system for backside dielectric patterning for wafer warpage and stress controlHINER DAVID JON·Filed 2012·Granted Mar 24, 2015·16 cites·26 claims
- 2795US8390130B1Through via recessed reveal structure and methodHINER DAVID JON·Filed 2011·Granted Mar 5, 2013·19 cites·17 claims
- 2894US11652038B2Semiconductor package with front side and back side redistribution structures and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted May 16, 2023·2 cites·20 claims
- 2993US10312220B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jun 4, 2019·12 cites·23 claims
- 3093US9048298B1Backside warpage control structure and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Jun 2, 2015·15 cites·20 claims
- 3192US12021854B2Secure permissioning of access to user accounts, including secure deauthorization of access to user accountsPLAID INC·Filed 2022·Granted Jun 25, 2024·1 cites·20 claims
- 3292US10943858B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Mar 9, 2021·5 cites·20 claims
- 3392US9852976B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Dec 26, 2017·6 cites·20 claims
- 3492US9433117B1Shield lid interconnect package and methodCHUN JONG OK·Filed 2012·Granted Aug 30, 2016·14 cites·24 claims
- 3592US5798567ABall grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitorsHEWLETT PACKARD CO·Filed 1997·Granted Aug 25, 1998·239 cites·8 claims
- 3691US12141320B2Secure permissioning of access to user accounts, including secure distribution of aggregated user account dataPLAID INC·Filed 2023·Granted Nov 12, 2024·1 cites·20 claims
- 3791US11803660B2Secure permissioning of access to user accounts, including secure distribution of aggregated user account dataPLAID INC·Filed 2021·Granted Oct 31, 2023·2 cites·20 claims
- 3891US10714378B2Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Jul 14, 2020·5 cites·20 claims
- 3991US10672740B2Semiconductor package with high routing density patchAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 2, 2020·4 cites·13 claims
- 4091US9100390B1Method and system for enrolling and authenticating computing devices for data usage accountingOPENPEAK INC·Filed 2015·Granted Aug 4, 2015·18 cites·16 claims
- 4190US11031256B2Semiconductor device with tiered pillar and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 8, 2021·2 cites·19 claims
- 4290US10497674B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 3, 2019·6 cites·26 claims
- 4390US9553041B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 24, 2017·5 cites·20 claims
- 4490US8796072B2Method and system for a semiconductor device package with a die-to-die first bondKELLY MICHAEL G·Filed 2012·Granted Aug 5, 2014·11 cites·20 claims
- 4590US2025096107A1Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 4689US9818684B2Electronic device with a plurality of redistribution structures having different respective sizesAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 14, 2017·11 cites·22 claims
- 4789US9129943B1Embedded component package and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Sep 8, 2015·9 cites·20 claims
- 4888US10090234B2Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Oct 2, 2018·4 cites·20 claims
- 4988US9437575B1Semiconductor device package formed in a chip-on-wafer last process using thin film adhesivesAMKOR TECHNOLOGY INC·Filed 2014·Granted Sep 6, 2016·8 cites·19 claims
- 5087US12438124B2Semiconductor package with routing patch and method of fabricating the semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Oct 7, 2025·0 cites·18 claims
Showing the top 50 of 106 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Michael Kelly files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →