Inventor · disambiguated record
Frans Lautzenhiser
Also filed as: LAUTZENHISER FRANS · LAUTZENHISER FRANS P · LAUTZENHISER FRANS PETER
25 granted patents·3 pending applications·252 citations·filing 1993–2015
95Inventor score
Top patents by PatentIndex Score
28 records- 0183US9050628B2Pulse-echo acoustic transducerLAUTZENHISER FRANS·Filed 2013·Granted Jun 9, 2015·11 cites·13 claims
- 0278US5527627AInk composition for an ultra-thick thick film for thermal management of a hybrid circuitDELCO ELECTRONICS CORP·Filed 1994·Granted Jun 18, 1996·66 cites·9 claims
- 0375US6743534B2Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the sameHERAEUS INC·Filed 2002·Granted Jun 1, 2004·24 cites·25 claims
- 0475US6233817B1Method of forming thick-film hybrid circuit on a metal circuit boardDELPHI TECH INC·Filed 1999·Granted May 22, 2001·50 cites·19 claims
- 0570US9142752B2Low frequency broad band ultrasonic transducersLAUTZENHISER FRANS·Filed 2013·Granted Sep 22, 2015·4 cites·5 claims
- 0669US9105836B2Enhanced bandwidth transducer for well integrity measurementMATAM MAHESH·Filed 2012·Granted Aug 11, 2015·4 cites·14 claims
- 0766US9976406B2Enhanced bandwidth transducer method for well integrity measurementPIEZOTECH LLC·Filed 2015·Granted May 22, 2018·2 cites·16 claims
- 0858US8908889B2Temperature compensated piezoelectric buzzerPIEZOTECH LLC·Filed 2013·Granted Dec 9, 2014·2 cites·11 claims
- 0957US5524490AInductive proximity sensorDELCO ELECTRONICS CORP·Filed 1995·Granted Jun 11, 1996·18 cites·2 claims
- 1053US7476422B2Copper circuit formed by kinetic sprayDELPHI TECH INC·Filed 2002·Granted Jan 13, 2009·6 cites·8 claims
- 1151US9078067B2Sounder assembly for explosive environmentPIEZOTECH LLC·Filed 2014·Granted Jul 7, 2015·0 cites·14 claims
- 1248US5680814ASqueegee device for screen printing processesDELCO ELECTRONICS CORP·Filed 1996·Granted Oct 28, 1997·13 cites·2 claims
- 1347US9690956B2Ultrasonic identification of replaceable component for host systemPIEZOTECH LLC·Filed 2015·Granted Jun 27, 2017·0 cites·14 claims
- 1447US9141834B2Ultrasonic identification of replaceable component for host systemLAUTZENHISER FRANS·Filed 2013·Granted Sep 22, 2015·0 cites·25 claims
- 1546US6949156B2Methods for making and using self-constrained low temperature glass-ceramic unfired tape for microelectronicsHERAEUS INC·Filed 2004·Granted Sep 27, 2005·3 cites·10 claims
- 1645US5910334AMethod of manufacture for a thick film multi-layer circuitDELCO ELECTRONICS CORP·Filed 1997·Granted Jun 8, 1999·12 cites·13 claims
- 1745US2014265732A1Pressure-compensated transducer assemblyPIEZOTECH LLC·Filed 2014·Application pending·0 cites
- 1840US6143355APrint alignment method for multiple print thick film circuitsDELPHI TECH INC·Filed 1999·Granted Nov 7, 2000·8 cites·12 claims
- 1939US5456109AThick film rotational accelerometer having two structurally integrated linear acceleration sensorsDELCO ELECTRONICS CORP·Filed 1993·Granted Oct 10, 1995·10 cites·1 claims
- 2037US8984945B2System and device for acoustic measuring in a mediumDALLAS JAMES·Filed 2012·Granted Mar 24, 2015·0 cites·26 claims
- 2136US6328914B1Thick-film paste with insoluble additiveDELPHI TECH INC·Filed 1999·Granted Dec 11, 2001·6 cites·14 claims
- 2235US6538325B2Multi-layer conductor system with intermediate buffer layer for improved adhesion to dielectricsDELPHI TECH INC·Filed 2001·Granted Mar 25, 2003·0 cites·20 claims
- 2335US6007867AMethod of manufacturing a thick film circuit with improved dielectric feature definitionDELCO ELECTRONICS CORP·Filed 1998·Granted Dec 28, 1999·4 cites·9 claims
- 2434US6164522AMethod of manufacturing a thick film circuit with constrained adhesive spreadingDELPHI TECH INC·Filed 1999·Granted Dec 26, 2000·4 cites·4 claims
- 2534US2012182833A1Ultrasonic id readerLAUTZENHISER FRANS·Filed 2011·Application pending·0 cites
- 2633US6150041AThick-film circuits and metallization processDELPHI TECH INC·Filed 1999·Granted Nov 21, 2000·4 cites·20 claims
- 2733US2011264012A1Compliant couplant with liquid reservoir for transducerLAUTZENHISER FRANS·Filed 2010·Application pending·0 cites
- 2825US5464570ATHFA/PDP thermoset thick films for printed circuitsDELCO ELECTRONICS CORP·Filed 1993·Granted Nov 7, 1995·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →