Inventor · disambiguated record
Devdatta P. Kulkarni
Also filed as: KULKARNI DEVDATTA · KULKARNI DEVDATTA P · KULKARNI DEVDATTA PRAKASH
25 granted patents·18 pending applications·149 citations·filing 2012–2025
95Inventor score
Files withINTEL CORP33TECO WESTINGHOUSE MOTOR CO4TECO-WESTINGHOUSE MOTOR COMPANY2ALTERA CORP1KULKARNI DEVDATTA1
Top patents by PatentIndex Score
43 records- 0196US10228735B2Methods of direct cooling of packaged devices and structures formed therebyINTEL CORP·Filed 2017·Granted Mar 12, 2019·18 cites·25 claims
- 0295US9363930B2Passive two phase cooling solution for low, medium and high voltage drive systemsTECO WESTINGHOUSE MOTOR CO·Filed 2013·Granted Jun 7, 2016·16 cites·19 claims
- 0393US9153374B2Cooling arrangements for drive systemsKULKARNI DEVDATTA·Filed 2013·Granted Oct 6, 2015·27 cites·17 claims
- 0491US12055986B2Flexible and modular top and bottom side processor unit module coolingINTEL CORP·Filed 2021·Granted Aug 6, 2024·6 cites·25 claims
- 0590US10168749B2Cooling using adjustable thermal couplingINTEL CORP·Filed 2016·Granted Jan 1, 2019·8 cites·20 claims
- 0690US8976526B2Providing a cooling system for a medium voltage drive systemKULKARNI DEVDATTA P·Filed 2012·Granted Mar 10, 2015·42 cites·24 claims
- 0785US9983641B2Tunable two phase liquid cooling thermal management method and apparatusINTEL CORP·Filed 2016·Granted May 29, 2018·5 cites·18 claims
- 0884US10074591B1System with provision of a thermal interface to a printed circuit boardINTEL CORP·Filed 2017·Granted Sep 11, 2018·4 cites·15 claims
- 0983US11249522B2Heat transfer apparatus for a computer environmentINTEL CORP·Filed 2016·Granted Feb 15, 2022·4 cites·35 claims
- 1081US10945353B2Mechanism with folded wrapping to seal components immersed in coolantINTEL CORP·Filed 2017·Granted Mar 9, 2021·4 cites·23 claims
- 1181US10727160B2Thermal management componentINTEL CORP·Filed 2017·Granted Jul 28, 2020·3 cites·18 claims
- 1279US2025024647A1Cooling mass and spring element for low insertion force hot swappable electronic component interfaceINTEL CORP·Filed 2024·Application pending·0 cites
- 1378US12504799B2Flexible and modular top and bottom side processor unit module coolingINTEL CORP·Filed 2024·Granted Dec 23, 2025·0 cites·19 claims
- 1478US10468331B2Heat management systemINTEL CORP·Filed 2018·Granted Nov 5, 2019·3 cites·25 claims
- 1576US2025338455A1Liquid cooled module for narrow pitch slotsINTEL CORP·Filed 2025·Application pending·0 cites
- 1675US10770372B2Fluid routing devices and methods for cooling integrated circuit packagesALTERA CORP·Filed 2016·Granted Sep 8, 2020·3 cites·19 claims
- 1774US11026351B2Computing apparatus with closed cooling loopINTEL CORP·Filed 2015·Granted Jun 1, 2021·2 cites·20 claims
- 1873US12133368B2Cooling mass and spring element for low insertion force hot swappable electronic component interfaceINTEL CORP·Filed 2022·Granted Oct 29, 2024·0 cites·19 claims
- 1969US12035507B2Technologies for dynamic cooling in a multi-chip package with programmable impingement valvesINTEL CORP·Filed 2022·Granted Jul 9, 2024·0 cites·27 claims
- 2067US9531242B2Apparatuses and methods for cooling electric machinesTECO-WESTINGHOUSE MOTOR COMPANY·Filed 2013·Granted Dec 27, 2016·3 cites·16 claims
- 2165US12093092B2Heat transfer apparatus for a computer environmentINTEL CORP·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 2260US12320446B2Pressure regulator valve assembly for quick disconnect fittingsINTEL CORP·Filed 2021·Granted Jun 3, 2025·0 cites·21 claims
- 2359US9819248B2Assemblies and methods for cooling electric machinesTECO-WESTINGHOUSE MOTOR COMPANY·Filed 2013·Granted Nov 14, 2017·1 cites·14 claims
- 2458US2022015262A1Technologies for dynamic cooling in a multi-chip package with programmable impingement valvesINTEL CORP·Filed 2020·Application pending·0 cites
- 2558US2021321543A1Liquid cooled module for narrow pitch slotsINTEL CORP·Filed 2021·Application pending·0 cites
- 2657US12345474B2Variable conductance heat pipes for improved reliabilityINTEL CORP·Filed 2020·Granted Jul 1, 2025·0 cites·15 claims
- 2756US2018323684A1Assemblies and Methods for Cooling Electric MachinesTECO WESTINGHOUSE MOTOR CO·Filed 2017·Application pending·0 cites
- 2856US2019094925A1Methods of direct cooling of packaged devices and structures formed therebyINTEL CORP·Filed 2018·Application pending·0 cites
- 2952US2023253288A1Immersion cooling for integrated circuit devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 3052US2025285939A1Compact form factor fluid flow regulatorINTEL CORP·Filed 2025·Application pending·0 cites
- 3151US2023125822A1Immersion cooling for integrated circuit devicesINTEL CORP·Filed 2021·Application pending·0 cites
- 3250US2023422389A1Cold plates for secondary side components of printed circuit boardsINTEL CORP·Filed 2023·Application pending·0 cites
- 3349US10455731B2Hydraulic bladder for CPU interconnection and coolingINTEL CORP·Filed 2017·Granted Oct 22, 2019·0 cites·18 claims
- 3449US2023025921A1Cold plates and liquid cooling systems for electronic devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 3545US2021321526A1Technologies for sealed liquid cooling systemKULKARNI DEVDATTA PRAKASH·Filed 2021·Application pending·0 cites
- 3645US2021185850A1Hybrid liquid coolingINTEL CORP·Filed 2021·Application pending·0 cites
- 3744US10765039B2Two-phase liquid-vapor computer cooling deviceINTEL CORP·Filed 2017·Granted Sep 1, 2020·0 cites·24 claims
- 3844US2024260233A1Dimm cooling assembliesINTEL CORP·Filed 2021·Application pending·0 cites
- 3943US9373988B2Assemblies and methods for cooling electric machinesTECO WESTINGHOUSE MOTOR CO·Filed 2013·Granted Jun 21, 2016·0 cites·8 claims
- 4043US2018066663A1Cooling using coolant-driven fansINTEL CORP·Filed 2016·Application pending·0 cites
- 4141US2014183988A1Assemblies For Cooling Electric MachinesTECO WESTINGHOUSE MOTOR CO·Filed 2013·Application pending·0 cites
- 4240US2022225542A1Thin form factor assemblies for cooling dimmsINTEL CORP·Filed 2022·Application pending·0 cites
- 4337US2018270993A1Cooling using a wick with varied thicknessINTEL CORP·Filed 2017·Application pending·0 cites
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