Inventor · disambiguated record
Lai Yee Chia
Also filed as: CHIA LAI YEE
6 granted patents·30 citations·filing 2011–2017
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0190US9184104B1Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulantSTATS CHIPPAC LTD·Filed 2014·Granted Nov 10, 2015·17 cites·31 claims
- 0283US10553487B2Semiconductor device and method of forming conductive vias by direct via reveal with organic passivationSTATS CHIPPAC PTE LTD·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0374US8558389B2Semiconductor device and method of forming guard ring around conductive TSV through semiconductor waferNA DUK JU·Filed 2011·Granted Oct 15, 2013·5 cites·20 claims
- 0465US9824923B2Semiconductor device and method of forming conductive pillar having an expanded baseSHARIFF DZAFIR·Filed 2012·Granted Nov 21, 2017·4 cites·18 claims
- 0551US9768066B2Semiconductor device and method of forming conductive vias by direct via reveal with organic passivationSTATS CHIPPAC LTD·Filed 2014·Granted Sep 19, 2017·0 cites·22 claims
- 0651US9257382B2Semiconductor device and method of forming guard ring around conductive TSV through semiconductor waferSTATS CHIPPAC LTD·Filed 2013·Granted Feb 9, 2016·0 cites·25 claims
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