Inventor · disambiguated record
William A. Reinerth
Also filed as: REINERTH SR WILLIAM A · REINERTH WILLIAM · REINERTH WILLIAM A
23 granted patents·13 pending applications·222 citations·filing 2000–2025
94Inventor score
Top patents by PatentIndex Score
36 records- 0194US6767930B1Polyhedral oligomeric silsesquioxane polyimide compositesFiled 2002·Granted Jul 27, 2004·96 cites·8 claims
- 0292US10604628B2Polymer and thermosetting composition containing sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Mar 31, 2020·2 cites·39 claims
- 0392US10563014B2Dielectric film forming compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Feb 18, 2020·3 cites·37 claims
- 0492US6911518B2Polyhedral oligomeric -silsesquioxanes, -silicates and -siloxanes bearing ring-strained olefinic functionalitiesHYBRID PLASTICS LLC·Filed 2000·Granted Jun 28, 2005·52 cites·7 claims
- 0591US9617386B2Process for the production of polyimide and polyamic ester polymersFUJIFILM ELECTRONIC MAT USA INC·Filed 2014·Granted Apr 11, 2017·4 cites·20 claims
- 0691US6972312B1Process for the formation of polyhedral oligomeric silsesquioxanesHYBRID PLASTICS LLC·Filed 2000·Granted Dec 6, 2005·48 cites·55 claims
- 0791US2025189892A1Poly-o-hydroxyamides comprising novel indane bis-o-aminophenols, photosensitive compositions, dielectric films, and buffer coatings containing the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 0891US2025188311A1Poly-o-hydroxyamides comprising novel indane bis-o-aminophenols, photosensitive compositions, dielectric films, and buffer coatings containing the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 0991US2025188312A1Poly-o-hydroxyamides comprising novel indane bis-o-aminophenols, photosensitive compositions, dielectric films, and buffer coatings containing the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 1090US9695284B2Polymer and thermosetting composition containing sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2014·Granted Jul 4, 2017·3 cites·22 claims
- 1187US10036952B2Photosensitive polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Jul 31, 2018·4 cites·45 claims
- 1283US11899364B2Photosensitive polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Feb 13, 2024·1 cites·22 claims
- 1381US10875965B2Dielectric film forming compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Dec 29, 2020·2 cites·42 claims
- 1478US10781341B2Polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2015·Granted Sep 22, 2020·2 cites·33 claims
- 1577US12338309B2Dielectric film-forming compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Granted Jun 24, 2025·0 cites·18 claims
- 1674US2025285785A1Dry filmFUJIFILM ELECTRONIC MAT USA INC·Filed 2025·Application pending·0 cites
- 1771US9777117B2Process for the production of polyimide and polyamic ester polymersFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Oct 3, 2017·0 cites·27 claims
- 1869US7638195B2Surface modification with polyhedral oligomeric silsesquioxanes silanolsHYBRID PLASTICS INC·Filed 2006·Granted Dec 29, 2009·5 cites·6 claims
- 1968US11945894B2Dielectric film-forming compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Apr 2, 2024·0 cites·14 claims
- 2067US2024408590A1Bioderived organic solventsFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 2163US11939428B2PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Mar 26, 2024·0 cites·33 claims
- 2261US11782344B2Photosensitive polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Oct 10, 2023·0 cites·21 claims
- 2360US2024248400A1Dielectric film forming composition containing acyl germanium compoundFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Application pending·0 cites
- 2460US2025046717A1Microelectronic Devices with Good Reliability and Related Compositions and MethodsFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 2560US2023053355A1Dry FilmFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Application pending·0 cites
- 2656US2022127459A1Dielectric Film-Forming CompositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Application pending·0 cites
- 2751US2005239985A1Process for the formation of polyhedral oligomeric silsesquioxanesHYBRID PLASTICS LLC·Filed 2005·Application pending·0 cites
- 2850US10793676B2PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Oct 6, 2020·0 cites·38 claims
- 2949US10696932B2Cleaning compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Jun 30, 2020·0 cites·40 claims
- 3049US2020262978A1PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Application pending·0 cites
- 3149US2022017673A1Dielectric Film Forming CompositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Application pending·0 cites
- 3248US11634529B2Multilayer structureFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Apr 25, 2023·0 cites·16 claims
- 3346US8076443B2Preparation of polyhedral oligomeric silsesquioxane silanols and siloxides functionalized with olefinic groupsSCHWAB JOSEPH J·Filed 2006·Granted Dec 13, 2011·0 cites·10 claims
- 3445US11175582B2Photosensitive stacked structureFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Nov 16, 2021·0 cites·24 claims
- 3538US11061327B2PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Jul 13, 2021·0 cites·37 claims
- 3636US2017255100A1Dry film structureFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →