Inventor · disambiguated record
Glenn L. Kehley
Also filed as: KEHLEY GLENN L · KEHLEY GLENN LEE
15 granted patents·3 pending applications·1,008 citations·filing 1995–2007
95Inventor score
Top patents by PatentIndex Score
18 records- 0196US5919050AMethod and apparatus for separable interconnecting electronic componentsIBM·Filed 1997·Granted Jul 6, 1999·153 cites·17 claims
- 0294US5984691AFlexible circuitized interposer with apertured member and method for making sameIBM·Filed 1998·Granted Nov 16, 1999·160 cites·10 claims
- 0394US5926369AVertically integrated multi-chip circuit package with heat-sink supportIBM·Filed 1998·Granted Jul 20, 1999·182 cites·31 claims
- 0494US5759047AFlexible circuitized interposer with apertured member and method for making sameIBM·Filed 1996·Granted Jun 2, 1998·169 cites·40 claims
- 0589US6061245AFree standing, three dimensional, multi-chip, carrier package with air flow baffleIBM·Filed 1998·Granted May 9, 2000·91 cites·14 claims
- 0686US6037658AElectronic package with heat transfer meansIBM·Filed 1997·Granted Mar 14, 2000·88 cites·40 claims
- 0781US6075287AIntegrated, multi-chip, thermally conductive packaging device and methodologyIBM·Filed 1997·Granted Jun 13, 2000·70 cites·30 claims
- 0873US6534763B2Low maintenance line scan cameraLOCKHEED CORP·Filed 2001·Granted Mar 18, 2003·11 cites·26 claims
- 0972US7350690B2Method and apparatus for containing mail articles deposited in a mail drop boxLOCKHEED CORP·Filed 2007·Granted Apr 1, 2008·3 cites·18 claims
- 1072US6809330B2Automatic calibration and built-in diagnostic procedures for line scan camerasLOCKHEED CORP·Filed 2002·Granted Oct 26, 2004·12 cites·29 claims
- 1165US7175068B2Method and apparatus for containing mail articles deposited in a mail drop boxLOCKHEED CORP·Filed 2004·Granted Feb 13, 2007·9 cites·11 claims
- 1261US6256203B1Free standing, three dimensional, multi-chip, carrier package with air flow baffleIBM·Filed 1999·Granted Jul 3, 2001·22 cites·20 claims
- 1361US5673177AHeat sink structure with corrugated wound wire heat conductive elementsIBM·Filed 1995·Granted Sep 30, 1997·27 cites·61 claims
- 1447US2003034447A1Low maintenance line scan cameraLOCKHEED CORP·Filed 2002·Application pending·0 cites
- 1545US5938454AElectrical connector assembly for connecting first and second circuitized substratesIBM·Filed 1997·Granted Aug 17, 1999·11 cites·32 claims
- 1643US2004179923A1Automated transportation mechanism for conveyence and positioning of test containersLOCKHEED CORP·Filed 2003·Application pending·0 cites
- 1738US2008049972A1Mail imaging system with secondary illumination/imaging windowLOCKHEED CORP·Filed 2007·Application pending·0 cites
- 1831US7672479B2Low maintenance flat mail line scan camera systemLOCKHEED CORP·Filed 2005·Granted Mar 2, 2010·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →