Inventor · disambiguated record
Hideaki Ohkura
Also filed as: OHKURA HIDEAKI
6 granted patents·2 pending applications·72 citations·filing 1984–2007
83Inventor score
Top patents by PatentIndex Score
8 records- 0180US4573656AFluid-sealed engine mountingHONDA MOTOR CO LTD·Filed 1984·Granted Mar 4, 1986·32 cites·10 claims
- 0269US7875807B2Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resinRICOH CO LTD·Filed 2007·Granted Jan 25, 2011·3 cites·15 claims
- 0361US7364769B2Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereofRICOH KK·Filed 2004·Granted Apr 29, 2008·10 cites·10 claims
- 0460US7748114B2Method of forming conductive patternRICOH KK·Filed 2006·Granted Jul 6, 2010·2 cites·12 claims
- 0558US7157800B2Bonded structure using conductive adhesives, and a manufacturing method thereofRICOH KK·Filed 2004·Granted Jan 2, 2007·7 cites·18 claims
- 0658US4709898AFluid-sealed engine mountingHONDA MOTOR CO LTD·Filed 1985·Granted Dec 1, 1987·18 cites·3 claims
- 0743US2005252398A1Pattern form object and a manufacturing method thereofOHKURA HIDEAKI·Filed 2005·Application pending·0 cites
- 0841US2004108133A1Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resinFiled 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →