Inventor · disambiguated record
Ognian N. Dimov
Also filed as: DIMOV OGNIAN · DIMOV OGNIAN N
17 granted patents·3 pending applications·97 citations·filing 2002–2021
90Inventor score
Files withFUJIFILM ELECTRONIC MAT USA INC14ARCH SPEC CHEM INC2DE BINOD B2DIMOV OGNIAN N1FUJIFILM ELECTRONIC MATERIALS1
Top patents by PatentIndex Score
20 records- 0193US6855476B2Photoacid generators for use in photoresist compositionsARCH SPEC CHEM INC·Filed 2002·Granted Feb 15, 2005·58 cites·29 claims
- 0287US10036952B2Photosensitive polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Jul 31, 2018·4 cites·45 claims
- 0385US6916543B2Copolymer, photoresist compositions thereof and deep UV bilayer system thereofARCH SPEC CHEM INC·Filed 2003·Granted Jul 12, 2005·28 cites·68 claims
- 0483US11899364B2Photosensitive polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Feb 13, 2024·1 cites·22 claims
- 0581US10875965B2Dielectric film forming compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Dec 29, 2020·2 cites·42 claims
- 0678US10781341B2Polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2015·Granted Sep 22, 2020·2 cites·33 claims
- 0764US8153346B2Thermally cured underlayer for lithographic applicationDE BINOD B·Filed 2008·Granted Apr 10, 2012·2 cites·8 claims
- 0863US11939428B2PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Mar 26, 2024·0 cites·33 claims
- 0961US11782344B2Photosensitive polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Oct 10, 2023·0 cites·21 claims
- 1053US11721543B2Planarizing process and compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Aug 8, 2023·0 cites·14 claims
- 1150US10793676B2PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Oct 6, 2020·0 cites·38 claims
- 1249US10696932B2Cleaning compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Jun 30, 2020·0 cites·40 claims
- 1349US10345707B2Stripping processFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Jul 9, 2019·0 cites·21 claims
- 1449US2020262978A1PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Application pending·0 cites
- 1549US2022017673A1Dielectric Film Forming CompositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Application pending·0 cites
- 1648US8535872B2Thermally cured underlayer for lithographic applicationDE BINOD B·Filed 2012·Granted Sep 17, 2013·0 cites·9 claims
- 1745US11175582B2Photosensitive stacked structureFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Nov 16, 2021·0 cites·24 claims
- 1845US2008199805A1Photosensitive compositions employing silicon-containing additivesFUJIFILM ELECTRONIC MATERIALS·Filed 2008·Application pending·0 cites
- 1938US11061327B2PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Jul 13, 2021·0 cites·37 claims
- 2029US9034557B2Chemically amplified positive photoresist compositionDIMOV OGNIAN N·Filed 2010·Granted May 19, 2015·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →