Inventor · disambiguated record
Byung-Iyul Park
Also filed as: PARK BYUNG-IYUL
6 granted patents·1 pending application·95 citations·filing 2011–2017
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0197US10153219B2Fan out wafer level package type semiconductor package and package on package type semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 11, 2018·52 cites·20 claims
- 0291US8426308B2Method of forming through silicon via of semiconductor device using low-k dielectric materialHAN KYU-HEE·Filed 2011·Granted Apr 23, 2013·16 cites·20 claims
- 0390US9214411B2Integrated circuit devices including a through-silicon via structure and methods of fabricating the samePARK JAE-HWA·Filed 2014·Granted Dec 15, 2015·12 cites·15 claims
- 0489US9735090B2Integrated circuit devices having through-silicon vias and methods of manufacturing such devicesCHOI JU-IL·Filed 2015·Granted Aug 15, 2017·10 cites·20 claims
- 0580US9698051B2Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 4, 2017·3 cites·19 claims
- 0667US9530726B2Semiconductor device and method of fabricating the sameMOON KWANG-JIN·Filed 2013·Granted Dec 27, 2016·2 cites·16 claims
- 0741US2013221519A1Semiconductor devices including dummy solder bumpsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →