Inventor · disambiguated record
Anton-Zoran Miric
Also filed as: MIRIC ANTON · MIRIC ANTON-ZORAN
3 granted patents·6 pending applications·5 citations·filing 2015–2022
58Inventor score
Top patents by PatentIndex Score
9 records- 0176US10593608B2Semiconductor module comprising an encapsulating compound that covers at least one semiconductor componentHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Granted Mar 17, 2020·2 cites·11 claims
- 0274US12059739B2Method for producing a metal-ceramic substrateHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2022·Granted Aug 13, 2024·1 cites·20 claims
- 0370US10622331B2Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic componentHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2016·Granted Apr 14, 2020·2 cites·11 claims
- 0453US2024025148A1Layered compositeHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2021·Application pending·0 cites
- 0547US2022411339A1Method for producing a metal-ceramic substrate and furnaceHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2022·Application pending·0 cites
- 0643US2017133291A1Semiconductor module comprising an encapsulating compound that covers at least one semiconductor componentHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2015·Application pending·0 cites
- 0739US2024006191A1Process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packagesHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2020·Application pending·0 cites
- 0835US2020199029A1Logic power module with a thick-film paste mediated substrate bonded with metal or metal hybrid foilsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Application pending·0 cites
- 0928US2019002359A1Thick-film paste mediated ceramics bonded with metal or metal hybrid foilsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →