Inventor · disambiguated record
Kent L. Kime
Also filed as: KIME KENT · KIME KENT L · KIME KENT LAMAR
11 granted patents·1 pending application·143 citations·filing 1998–2020
91Inventor score
Top patents by PatentIndex Score
12 records- 0196US11181006B2Turbine tip shroud assembly with plural shroud segments having inter-segment seal arrangementHONEYWELL INT INC·Filed 2020·Granted Nov 23, 2021·17 cites·20 claims
- 0296US10907487B2Turbine shroud assemblies for gas turbine enginesHONEYWELL INT INC·Filed 2018·Granted Feb 2, 2021·24 cites·20 claims
- 0394US10677084B2Turbine tip shroud assembly with plural shroud segments having inter-segment seal arrangementHONEYWELL INT INC·Filed 2018·Granted Jun 9, 2020·10 cites·20 claims
- 0494US10359051B2Impeller shroud supports having mid-impeller bleed flow passages and gas turbine engines including the sameHONEYWELL INT INC·Filed 2016·Granted Jul 23, 2019·13 cites·20 claims
- 0592US10900378B2Turbine tip shroud assembly with plural shroud segments having internal cooling passagesHONEYWELL INT INC·Filed 2018·Granted Jan 26, 2021·7 cites·11 claims
- 0690USD489338SPackaged semiconductor deviceSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted May 4, 2004·43 cites·1 claims
- 0774US7901990B2Method of forming a molded array package device having an exposed tab and structureSEMICONDUCTOR COMPONENTS IND·Filed 2009·Granted Mar 8, 2011·5 cites·11 claims
- 0863US7602054B2Method of forming a molded array package device having an exposed tab and structureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Oct 13, 2009·2 cites·16 claims
- 0960US2021140343A1Turbine tip shroud assembly with plural shroud segments having internal cooling passagesHONEYWELL INT INC·Filed 2020·Application pending·0 cites
- 1055US7755179B2Semiconductor package structure having enhanced thermal dissipation characteristicsSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Jul 13, 2010·8 cites·5 claims
- 1151US6984876B2Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereofSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Jan 10, 2006·4 cites·23 claims
- 1238US6147410AElectronic component and method of manufactureMOTOROLA INC·Filed 1998·Granted Nov 14, 2000·10 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →