Inventor · disambiguated record
Hsu-Yang Lee
Also filed as: LEE HSU-YANG
2 granted patents·39 citations·filing 2008–2008
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0190US8115285B2Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereofCHEN CHIEN-WEN·Filed 2008·Granted Feb 14, 2012·22 cites·27 claims
- 0283US8492883B2Semiconductor package having a cavity structureCHIEN PAO-HUEI CHANG·Filed 2008·Granted Jul 23, 2013·17 cites·37 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →