Inventor · disambiguated record
Yu-Seock Yang
Also filed as: YANG YU-SEOCK
4 granted patents·1 pending application·138 citations·filing 2002–2004
79Inventor score
Files withLG ELECTRONICS INC5
Top patents by PatentIndex Score
5 records- 0193US7049178B2Method for fabricating semiconductor package and semiconductor packageLG ELECTRONICS INC·Filed 2003·Granted May 23, 2006·96 cites·29 claims
- 0280US6706564B2Method for fabricating semiconductor package and semiconductor packageLG ELECTRONICS INC·Filed 2002·Granted Mar 16, 2004·28 cites·10 claims
- 0359US7320173B2Method for interconnecting multi-layer printed circuit boardLG ELECTRONICS INC·Filed 2004·Granted Jan 22, 2008·9 cites·8 claims
- 0452US7189302B2Multi-layer printed circuit board and fabricating method thereofLG ELECTRONICS INC·Filed 2004·Granted Mar 13, 2007·5 cites·5 claims
- 0538US2004050708A1Plating method for PCBLG ELECTRONICS INC·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →