Inventor · disambiguated record
Shih-Yen Lin
Also filed as: LIN SHIH-YEN
42 granted patents·12 pending applications·111 citations·filing 2001–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD44IND TECH RES INST2TAIWAN SEMICONDUCTOR MFG2ACADEMIA SINICA1CHUNG SHAN INST OF SCIENCE1
Top patents by PatentIndex Score
54 records- 0195US9735043B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 15, 2017·16 cites·20 claims
- 0293US9577049B1Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 21, 2017·12 cites·20 claims
- 0392US9673119B2System and method for bonding package lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 6, 2017·10 cites·20 claims
- 0488US9786520B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·5 cites·20 claims
- 0587US7560728B2Vertical organic transistor and method of fabricating the sameIND TECH RES INST·Filed 2006·Granted Jul 14, 2009·21 cites·9 claims
- 0686US10269564B2Method of forming a semiconductor device using layered etching and repairing of damaged portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·3 cites·20 claims
- 0785US12513946B2Method for forming a semiconductor device having a 2-D material channel over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·1 cites·20 claims
- 0885US9899537B2Semiconductor device with transition metal dichalocogenide hetero-structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·4 cites·20 claims
- 0983US10872973B2Semiconductor structures with two-dimensional materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 22, 2020·3 cites·20 claims
- 1083US9287233B2Adhesive pattern for advance package reliability improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 15, 2016·6 cites·19 claims
- 1182US10985019B2Method of forming a semiconductor device using layered etching and repairing of damaged portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 20, 2021·1 cites·20 claims
- 1282US9859115B2Semiconductor devices comprising 2D-materials and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 2, 2018·3 cites·20 claims
- 1380US10157772B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
- 1478US2025366069A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1576US10636652B2Method of forming a semiconductor device using layered etching and repairing of damaged portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 28, 2020·1 cites·20 claims
- 1675US10269902B2Semiconductor device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·1 cites·20 claims
- 1774US2025331273A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1873US9893043B2Method of manufacturing a chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·3 cites·20 claims
- 1971US12363981B2Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 2070US9209046B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·2 cites·15 claims
- 2169US9142523B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·2 cites·20 claims
- 2268US9805997B2Packaging methods for semiconductor devices with encapsulant ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 31, 2017·2 cites·19 claims
- 2366US12266602B2Integrated circuit structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 2466US11211460B22D crystal hetero-structures and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 28, 2021·0 cites·20 claims
- 2566US9525072B2Semiconductor device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 20, 2016·1 cites·20 claims
- 2666US2024030034A12-d material semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2766US2025246537A1Integrated circuit structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2863US11171212B2Semiconductor device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·0 cites·20 claims
- 2963US6909108B2Structure of quantum dot light emitting diode and method of fabricating the sameCHUNG SHAN INST OF SCIENCE·Filed 2003·Granted Jun 21, 2005·12 cites·6 claims
- 3061US12417536B2Automated detection system for acute ischemic strokeNATIONAL YANG MING CHIAO TUNG UNIV·Filed 2023·Granted Sep 16, 2025·0 cites·8 claims
- 3161US11152209B2Forming semiconductor structures with two-dimensional materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
- 3260US12080557B2Method for forming 2-D material semiconductor device with improved source/drain electrodes and gate dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 3360US10879140B2System and method for bonding package lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·0 cites·20 claims
- 3460US10867835B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 3560US10505052B2Semiconductor device with transition metal dichalocogenide hetero-structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·0 cites·20 claims
- 3658US2025081499A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3757US10784351B22D crystal hetero-structures and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·0 cites·20 claims
- 3857US10541132B2Forming semiconductor structures with two-dimensional materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 21, 2020·0 cites·18 claims
- 3957US10269668B2System and method for bonding package lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·20 claims
- 4057US9853105B2Semiconductor device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·0 cites·20 claims
- 4157US2024105779A1Integrated circuit structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4256US10164122B2Semiconductor device with transition metal dichalocogenide hetero-structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·0 cites·13 claims
- 4354US10157737B2Semiconductor devices comprising 2D-materials and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·0 cites·20 claims
- 4454US2025022943A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4553US2024371944A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4650US2013266739A1Process for forming carbon film or inorganic material film on substrate by physical vapor depositionLIN SHIH-YEN·Filed 2012·Application pending·0 cites
- 4750US2024107903A1Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4848US11121214B2Source/drain contact with 2-D materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
- 4948US9415501B2Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·0 cites·19 claims
- 5048US9029190B2Method for manufacturing graphene film and graphene channel of transistorACADEMIA SINICA·Filed 2013·Granted May 12, 2015·0 cites·19 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →