Inventor · disambiguated record
Hui-Min Huang
Also filed as: HUANG HUI · HUANG HUI MIN HE · HUANG HUI ZHEN · HUANG HUI-MIN
105 granted patents·37 pending applications·287 citations·filing 1999–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD65INNOLUX CORP29REALTEK SEMICONDUCTOR CORP6MAI DE LTD5HUANG HUI-MIN4
Top patents by PatentIndex Score
142 records- 0196US11957018B2Display deviceINNOLUX CORP·Filed 2023·Granted Apr 9, 2024·2 cites·5 claims
- 0296US10276541B23D package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 30, 2019·12 cites·22 claims
- 0396US9768048B2Package on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·26 cites·20 claims
- 0495US11538897B2Display deviceINNOLUX CORP·Filed 2021·Granted Dec 27, 2022·3 cites·8 claims
- 0595US10032734B2Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·8 cites·20 claims
- 0695US9847317B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 19, 2017·16 cites·20 claims
- 0794US12015002B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·2 cites·20 claims
- 0893US11121201B2Display deviceINNOLUX CORP·Filed 2019·Granted Sep 14, 2021·6 cites·10 claims
- 0993US8033592B2Door assembly and method for a vehicleGM GLOBAL TECH OPERATIONS INC·Filed 2008·Granted Oct 11, 2011·40 cites·15 claims
- 1092US12027435B2Packages including multiple encapsulated substrate blocks and overlapping redistribution structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·1 cites·20 claims
- 1192US9991190B2Packaging with interposer frameHuang hui min·Filed 2012·Granted Jun 5, 2018·14 cites·20 claims
- 1292US9559005B2Methods of packaging and dicing semiconductor devices and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 31, 2017·14 cites·20 claims
- 1391US9349663B2Package-on-package structure having polymer-based material for warpage controlCHEN MENG-TSE·Filed 2012·Granted May 24, 2016·9 cites·20 claims
- 1490US2025323192A1Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1588US12394736B2Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 1688US9449908B2Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·5 cites·20 claims
- 1787US10324345B2Display device and display substrateINNOLUX CORP·Filed 2016·Granted Jun 18, 2019·4 cites·20 claims
- 1887US9524956B2Integrated fan-out structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 20, 2016·8 cites·20 claims
- 1987US2025364468A1Semiconductor device structure with conductive pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2086US2025343135A1Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2185US12419167B2Display deviceRED OAK INNOVATIONS LTD·Filed 2024·Granted Sep 16, 2025·0 cites·27 claims
- 2285US10642118B2Display substrate and display deviceINNOLUX CORP·Filed 2019·Granted May 5, 2020·2 cites·20 claims
- 2385US10043778B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 7, 2018·3 cites·20 claims
- 2485US2025362548A1Electronic deviceINNOLUX CORP·Filed 2025·Application pending·0 cites
- 2584US9627355B2Package-on-package structure having polymer-based material for warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·3 cites·20 claims
- 2684US9484285B2Interconnect structures for wafer level package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·6 cites·20 claims
- 2783US12463166B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 2883US12237320B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·16 claims
- 2983US12068303B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 3083US10971107B2Display deviceINNOLUX CORP·Filed 2017·Granted Apr 6, 2021·2 cites·12 claims
- 3183US2025323201A1Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3282US12412858B2Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 3382US11567377B2Electronic device with conductive lines on different levelsINNOLUX CORP·Filed 2020·Granted Jan 31, 2023·1 cites·17 claims
- 3482US9632375B2Display deviceINNOLUX CORP·Filed 2015·Granted Apr 25, 2017·3 cites·20 claims
- 3582US2025316632A1Semiconductor die including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3681US12381171B2Semiconductor die including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 3781US11184010B1Receiving end of electronic device and method of setting phase threshold of timing recovery operationREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Nov 23, 2021·2 cites·9 claims
- 3881US10640391B2LTO coated LRMO cathode and synthesisFORD GLOBAL TECH LLC·Filed 2017·Granted May 5, 2020·2 cites·17 claims
- 3981US10510719B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 4081US10192804B2Bump-on-trace packaging structure and method for forming the sameCHEN MENG TSE·Filed 2012·Granted Jan 29, 2019·5 cites·19 claims
- 4181US2024319551A1Electronic device with conductive lines having different widthsINNOLUX CORP·Filed 2024·Application pending·0 cites
- 4280US10770014B2Display deviceINNOLUX CORP·Filed 2019·Granted Sep 8, 2020·2 cites·19 claims
- 4380US10622240B2Package on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 14, 2020·2 cites·20 claims
- 4480US7820716B2Crystalline polymorphs of desvenlafaxine succinate and their preparationsMAI DE LTD·Filed 2007·Granted Oct 26, 2010·2 cites·21 claims
- 4579US12411384B2Electronic deviceINNOLUX CORP·Filed 2023·Granted Sep 9, 2025·0 cites·6 claims
- 4679US12009345B23D package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 4779US9887162B2Molding structure for wafer level packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 6, 2018·4 cites·14 claims
- 4879US9750140B2Display deviceINNOLUX CORP·Filed 2015·Granted Aug 29, 2017·2 cites·18 claims
- 4979US9508703B2Stacked dies with wire bonds and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 29, 2016·4 cites·20 claims
- 5079US2024321661A1Packages with multiple encapsulated substrate blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 142 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →