Inventor · disambiguated record
Sri Ranga Sai Boyapati
Also filed as: BOYAPATI SRI RANGA · BOYAPATI SRI RANGA SAI · BOYAPATI SRI RANGA SAI SAI
69 granted patents·24 pending applications·219 citations·filing 2013–2025
98Inventor score
Files withINTEL CORP76ADVANCED MICRO DEVICES INC11BOYAPATI SRI RANGA SAI1Darmawikarta Kristof1MAY ROBERT ALAN1
Top patents by PatentIndex Score
93 records- 0199US10163798B1Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling sameINTEL CORP·Filed 2017·Granted Dec 25, 2018·105 cites·25 claims
- 0296US11393766B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2020·Granted Jul 19, 2022·3 cites·18 claims
- 0396US11043457B2Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling sameINTEL CORP·Filed 2020·Granted Jun 22, 2021·3 cites·9 claims
- 0496US10727185B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2016·Granted Jul 28, 2020·11 cites·20 claims
- 0594US10707168B2Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling sameINTEL CORP·Filed 2018·Granted Jul 7, 2020·7 cites·14 claims
- 0694US10431537B1Electromigration resistant and profile consistent contact arraysINTEL CORP·Filed 2018·Granted Oct 1, 2019·11 cites·26 claims
- 0793US11069620B2Die interconnect substrate, an electrical device and a method for forming a die interconnect substrateINTEL CORP·Filed 2017·Granted Jul 20, 2021·6 cites·25 claims
- 0893US9941054B2Integration of embedded thin film capacitors in package substratesINTEL CORP·Filed 2016·Granted Apr 10, 2018·9 cites·15 claims
- 0991US11443885B2Thin film barrier seed metallization in magnetic-plugged through hole inductorINTEL CORP·Filed 2018·Granted Sep 13, 2022·4 cites·12 claims
- 1090US11309239B2Electromigration resistant and profile consistent contact arraysINTEL CORP·Filed 2020·Granted Apr 19, 2022·2 cites·20 claims
- 1189US11935857B2Surface finishes with low RBTV for fine and mixed bump pitch architecturesINTEL CORP·Filed 2022·Granted Mar 19, 2024·1 cites·22 claims
- 1288US2025125275A1Multi-chip package with high density interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 1387US11101222B2Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layersINTEL CORP·Filed 2016·Granted Aug 24, 2021·4 cites·25 claims
- 1487US10692847B2Inorganic interposer for multi-chip packagingINTEL CORP·Filed 2015·Granted Jun 23, 2020·7 cites·9 claims
- 1586US10790233B2Package substrates with integral devicesINTEL CORP·Filed 2016·Granted Sep 29, 2020·5 cites·23 claims
- 1686US9420693B2Integration of embedded thin film capacitors in package substratesSANKMAN ROBERT L·Filed 2014·Granted Aug 16, 2016·7 cites·25 claims
- 1786US9202803B2Laser cavity formation for embedded dies or components in substrate build-up layersZHANG CHONG·Filed 2014·Granted Dec 1, 2015·8 cites·14 claims
- 1886US2024332203A1Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2024·Application pending·0 cites
- 1985US12300613B2Die interconnect substrate, an electrical device and a method for forming a die interconnect substrateINTEL CORP·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 2085US10872872B2Package substrate with high-density interconnect layer having pillar and via connections for fan out scalingINTEL CORP·Filed 2016·Granted Dec 22, 2020·4 cites·17 claims
- 2185US2025125277A1Panel level packaging for multi-die products interconnected with very high density (vhd) interconnect layersINTEL CORP·Filed 2024·Application pending·0 cites
- 2284US11430740B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2017·Granted Aug 30, 2022·2 cites·13 claims
- 2384US2025253245A1Die interconnect substrate, an electrical device and a method for forming a die interconnect substrateINTEL CORP·Filed 2025·Application pending·0 cites
- 2484US2025069902A1Integrated circuit package supportsINTEL CORP·Filed 2024·Application pending·0 cites
- 2583US12176223B2Integrated circuit package supportsINTEL CORP·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 2682US11532584B2Package substrate with high-density interconnect layer having pillar and via connections for fan out scalingINTEL CORP·Filed 2020·Granted Dec 20, 2022·1 cites·18 claims
- 2781US12218071B2Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layersINTEL CORP·Filed 2023·Granted Feb 4, 2025·0 cites·28 claims
- 2881US11901296B2Die interconnect substrate, an electrical device and a method for forming a die interconnect substrateINTEL CORP·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2981US11488918B2Surface finishes with low rBTV for fine and mixed bump pitch architecturesINTEL CORP·Filed 2018·Granted Nov 1, 2022·3 cites·15 claims
- 3080US12218069B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 3180US11894311B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2022·Granted Feb 6, 2024·0 cites·19 claims
- 3278US12046560B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2021·Granted Jul 23, 2024·0 cites·19 claims
- 3378US11908802B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2022·Granted Feb 20, 2024·0 cites·19 claims
- 3478US11211345B2In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the sameINTEL CORP·Filed 2017·Granted Dec 28, 2021·2 cites·19 claims
- 3577US11270959B2Enabling magnetic films in inductors integrated into semiconductor packagesINTEL CORP·Filed 2018·Granted Mar 8, 2022·3 cites·26 claims
- 3676US11854834B2Integrated circuit package supportsINTEL CORP·Filed 2022·Granted Dec 26, 2023·0 cites·17 claims
- 3776US11784128B2Die interconnect substrate, an electrical device and a method for forming a die interconnect substrateINTEL CORP·Filed 2021·Granted Oct 10, 2023·0 cites·20 claims
- 3876US11699648B2Electromigration resistant and profile consistent contact arraysTAHOE RES LTD·Filed 2022·Granted Jul 11, 2023·0 cites·20 claims
- 3976US9245795B2Methods of forming substrate microvias with anchor structuresINTEL CORP·Filed 2013·Granted Jan 26, 2016·3 cites·11 claims
- 4075US10978399B2Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrateINTEL CORP·Filed 2017·Granted Apr 13, 2021·2 cites·25 claims
- 4174US11735531B2Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layersINTEL CORP·Filed 2021·Granted Aug 22, 2023·0 cites·5 claims
- 4273US11764158B2Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling sameINTEL CORP·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 4372US11837534B2Substrate with variable height conductive and dielectric elementsINTEL CORP·Filed 2017·Granted Dec 5, 2023·2 cites·7 claims
- 4472US10494700B2Method of fabricating a microelectronic substrateINTEL CORP·Filed 2017·Granted Dec 3, 2019·0 cites·11 claims
- 4572US2024088121A1Patch accommodating embedded dies having different thicknessesINTEL CORP·Filed 2023·Application pending·0 cites
- 4670US11862619B2Patch accommodating embedded dies having different thicknessesINTEL CORP·Filed 2017·Granted Jan 2, 2024·1 cites·24 claims
- 4770US9758845B2Microelectronic substrates having copper alloy conductive route structuresINTEL CORP·Filed 2014·Granted Sep 12, 2017·0 cites·20 claims
- 4869US11908821B2Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packagingINTEL CORP·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 4969US11894324B2In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the sameINTEL CORP·Filed 2021·Granted Feb 6, 2024·0 cites·25 claims
- 5069US10121679B1Package substrate first-level-interconnect architectureINTEL CORP·Filed 2017·Granted Nov 6, 2018·1 cites·21 claims
Showing the top 50 of 93 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →