Inventor · disambiguated record
Gyung Hwan Oh
Also filed as: OH GYUNG HWAN
5 granted patents·2 pending applications·1 citations·filing 2018–2021
60Inventor score
Top patents by PatentIndex Score
7 records- 0170US12055378B2Thickness measuring deviceACTRO CO LTD·Filed 2020·Granted Aug 6, 2024·1 cites·19 claims
- 0254US11486822B2Specimen inspection device and specimen inspection methodUNIV HANYANG IND UNIV COOP FOUND·Filed 2019·Granted Nov 1, 2022·0 cites·15 claims
- 0350US11781981B2Specimen inspection apparatus and specimen inspection methodACTRO CO LTD·Filed 2019·Granted Oct 10, 2023·0 cites·13 claims
- 0449US11346659B2Device for measuring thickness of specimen and method for measuring thickness of specimenUNIV HANYANG IND UNIV COOP FOUND·Filed 2021·Granted May 31, 2022·0 cites·16 claims
- 0547US2020061704A1Method for manufacturing photo-sintering particle, method for manufacturing photo-sintering target, and photo-sintering methodIUCF HYU·Filed 2019·Application pending·0 cites
- 0644US11150080B2Thickness measurement apparatus, thickness measurement method, and thickness measurement programIUCF HYU·Filed 2018·Granted Oct 19, 2021·0 cites·17 claims
- 0742US2022268568A1Thickness measurement deviceIUCF HYU·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →