Inventor · disambiguated record
Shakti Singh Chauhan
Also filed as: CHAUHAN SHAKTI S · CHAUHAN SHAKTI SINGH
30 granted patents·8 pending applications·222 citations·filing 2009–2020
96Inventor score
Files withGEN ELECTRIC23APPLE INC7CHAUHAN SHAKTI SINGH2GE INTELLIGENT PLATFORMS INC2GOWDA ARUN VIRUPAKSHA2
Top patents by PatentIndex Score
38 records- 0196US9721903B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2015·Granted Aug 1, 2017·31 cites·20 claims
- 0296US8987876B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2013·Granted Mar 24, 2015·20 cites·42 claims
- 0395US9209151B2Embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2013·Granted Dec 8, 2015·19 cites·28 claims
- 0494US9704788B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2015·Granted Jul 11, 2017·9 cites·30 claims
- 0593US10186477B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2016·Granted Jan 22, 2019·8 cites·20 claims
- 0693US9391027B2Embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2015·Granted Jul 12, 2016·9 cites·19 claims
- 0791US8811014B2Heat exchange assembly and methods of assembling sameCHAUHAN SHAKTI SINGH·Filed 2011·Granted Aug 19, 2014·20 cites·18 claims
- 0890US10269688B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2013·Granted Apr 23, 2019·9 cites·21 claims
- 0990US8780559B2Heat exchange assembly for use with electrical devices and methods of assembling an electrical deviceWEAVER JR STANTON EARL·Filed 2011·Granted Jul 15, 2014·19 cites·16 claims
- 1089US9333599B2Electronics chassis and method of fabricating the sameGEN ELECTRIC·Filed 2013·Granted May 10, 2016·10 cites·20 claims
- 1189US8941208B2Reliable surface mount integrated power moduleCHAUHAN SHAKTI SINGH·Filed 2012·Granted Jan 27, 2015·10 cites·24 claims
- 1288US10115677B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2017·Granted Oct 30, 2018·5 cites·18 claims
- 1387US9299630B2Diffusion barrier for surface mount modulesGOWDA ARUN VIRUPAKSHA·Filed 2012·Granted Mar 29, 2016·10 cites·23 claims
- 1486US10522475B2Vertical interconnects for self shielded system in package (SiP) modulesAPPLE INC·Filed 2018·Granted Dec 31, 2019·4 cites·19 claims
- 1585US10667429B2Integrated heat exchange assembly and an associated method thereofGEN ELECTRIC·Filed 2017·Granted May 26, 2020·2 cites·20 claims
- 1682US10517003B2Systems and methods for maintaining service on multiple SIMs in a wireless communication device operating in a multi-SIM multi-standby (MSMS) modeQUALCOMM INC·Filed 2016·Granted Dec 24, 2019·5 cites·30 claims
- 1782US9615486B2Thermal interface devicesGEN ELECTRIC·Filed 2014·Granted Apr 4, 2017·6 cites·23 claims
- 1881US9806051B2Ultra-thin embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2014·Granted Oct 31, 2017·4 cites·17 claims
- 1981US9370090B2Circuit card assembly and method of manufacturing thereofGEN ELECTRIC·Filed 2014·Granted Jun 14, 2016·5 cites·20 claims
- 2081US9253871B2Circuit card assembly and method of fabricating the sameGEN ELECTRIC·Filed 2013·Granted Feb 2, 2016·7 cites·18 claims
- 2177US10631410B2Stacked printed circuit board packagesAPPLE INC·Filed 2017·Granted Apr 21, 2020·2 cites·16 claims
- 2271US9184124B2Reliable surface mount integrated power moduleGEN ELECTRIC·Filed 2014·Granted Nov 10, 2015·2 cites·21 claims
- 2368US9534855B2High specific area composite foam and an associated method of fabricationGEN ELECTRIC·Filed 2014·Granted Jan 3, 2017·2 cites·11 claims
- 2468US9066443B2Overlay circuit structure for interconnecting light emitting semiconductorsGOWDA ARUN VIRUPAKSHA·Filed 2011·Granted Jun 23, 2015·2 cites·26 claims
- 2566US11605609B2Ultra-thin embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2020·Granted Mar 14, 2023·0 cites·26 claims
- 2665US10535611B2Substrate-less integrated componentsAPPLE INC·Filed 2016·Granted Jan 14, 2020·1 cites·18 claims
- 2760US10607957B2Ultra-thin embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2017·Granted Mar 31, 2020·0 cites·15 claims
- 2860US10109593B2Self shielded system in package (SiP) modulesAPPLE INC·Filed 2015·Granted Oct 23, 2018·1 cites·18 claims
- 2957US2015060021A1Heat transfer device and an associated method of fabricationGEN ELECTRIC·Filed 2013·Application pending·0 cites
- 3055US10070531B2Overlay circuit structure for interconnecting light emitting semiconductorsGEN ELECTRIC·Filed 2014·Granted Sep 4, 2018·0 cites·25 claims
- 3152US2017263539A1Power overlay structure and method of making sameGEN ELECTRIC·Filed 2017·Application pending·0 cites
- 3250US2015173243A1Integrated heat exchange assembly and an associated method thereofGEN ELECTRIC·Filed 2013·Application pending·0 cites
- 3347US2017251572A1Circuit card assembly with thermal energy removalGE INTELLIGENT PLATFORMS INC·Filed 2014·Application pending·0 cites
- 3447US2010294461A1Enclosure for heat transfer devices, methods of manufacture thereof and articles comprising the sameGEN ELECTRIC·Filed 2009·Application pending·0 cites
- 3544US10147685B2System-in-package devices with magnetic shieldingAPPLE INC·Filed 2017·Granted Dec 4, 2018·0 cites·30 claims
- 3643US2015090428A1Heat transfer device having 3-dimensional projections and an associated method of fabricationGEN ELECTRIC·Filed 2013·Application pending·0 cites
- 3742US2016169594A1Heatspreader with extended surface for heat transfer through a sealed chassis wallGE INTELLIGENT PLATFORMS INC·Filed 2013·Application pending·0 cites
- 3835US2016021788A1Electronic device assemblyGEN ELECTRIC·Filed 2015·Application pending·0 cites
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