Inventor · disambiguated record
Yutaro Aoki
Also filed as: AOKI YUTARO
8 granted patents·4 pending applications·4 citations·filing 2017–2022
74Inventor score
Top patents by PatentIndex Score
12 records- 0187US12061025B2Power element and expansion valve using sameFUJIKOKI CORP·Filed 2020·Granted Aug 13, 2024·2 cites·6 claims
- 0286US12092380B2Power element and expansion valve using sameFUJIKOKI CORP·Filed 2020·Granted Sep 17, 2024·2 cites·6 claims
- 0360US12291541B2Compound, thin-film forming raw material, and method of producing thin-filmADEKA CORP·Filed 2020·Granted May 6, 2025·0 cites·9 claims
- 0457US12473309B2Organometallic compound and method of manufacturing integrated circuit using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·17 claims
- 0555US2022324887A1Organometallic adduct compound and method of manufacturing integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0654US12410203B2Organometallic adduct compound and method of manufacturing integrated circuit using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 9, 2025·0 cites·17 claims
- 0754US10900119B2Tungsten precursor and method of forming Tungsten containing layer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 26, 2021·0 cites·20 claims
- 0852US2021380622A1Materials for fabricating thin films, methods of fabricating thin films using the same, and equipment for fabricating thin films using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 0951US11466043B2Niobium compound and method of forming thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·17 claims
- 1049US2024030037A1Etching methodADEKA CORP·Filed 2021·Application pending·0 cites
- 1148US2023012455A1Power element and expansion valve using sameFUJIKOKI CORP·Filed 2020·Application pending·0 cites
- 1247US11807652B2Tungsten compound, raw material for thin film formation and method for producing thin filmADEKA CORP·Filed 2018·Granted Nov 7, 2023·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →