Inventor · disambiguated record
Yoshitsugu Katoh
Also filed as: KATOH YOSHITSUGU
8 granted patents·2 pending applications·438 citations·filing 1999–2007
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0194US6433418B1Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanismFUJITSU LTD·Filed 1999·Granted Aug 13, 2002·178 cites·4 claims
- 0287US6288444B1Semiconductor device and method of producing the sameFUJITSU LTD·Filed 1999·Granted Sep 11, 2001·80 cites·24 claims
- 0386US6559536B1Semiconductor device having a heat spreading plateFUJITSU LTD·Filed 2000·Granted May 6, 2003·42 cites·13 claims
- 0486US6333564B1Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodesFUJITSU LTD·Filed 1999·Granted Dec 25, 2001·87 cites·14 claims
- 0580US6796024B2Method for making semiconductor deviceFUJITSU LTD·Filed 2003·Granted Sep 28, 2004·27 cites·3 claims
- 0673US6424032B1Semiconductor device having a power supply ring and a ground ringFUJITSU LTD·Filed 2000·Granted Jul 23, 2002·22 cites·4 claims
- 0763US7692294B2Semiconductor device and method for fabricating the sameFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Apr 6, 2010·2 cites·11 claims
- 0848US7682140B2Mold for resin molding, resin molding apparatus, and semiconductor device manufacture methodFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Mar 23, 2010·0 cites·5 claims
- 0938US2001052653A1Semiconductor device and method of producing the sameFiled 2001·Application pending·0 cites
- 1028US2001045643A1Semiconductor device keeping structural integrity under heat-generated stressFiled 1999·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →