Inventor · disambiguated record
Hidehiko Kira
Also filed as: KIRA HIDEHIKO
64 granted patents·27 pending applications·445 citations·filing 1998–2018
99Inventor score
Files withFUJITSU LTD83FUJITSU FRONTECH LTD3ISHIKAWA NAOKI1TAKAHASHI TETSUYA1TOSHIBA STORAGE DEVICE CORP1
Top patents by PatentIndex Score
91 records- 0190US7471081B2Slider testerFUJITSU LTD·Filed 2006·Granted Dec 30, 2008·8 cites·1 claims
- 0290US6400529B1Integrated circuit chip supporting and electrically connecting a head sliderFUJITSU LTD·Filed 2000·Granted Jun 4, 2002·28 cites·15 claims
- 0389US6943971B2Slider testerFUJITSU LTD·Filed 2003·Granted Sep 13, 2005·29 cites·12 claims
- 0488US7514788B2Structure of mounting electronic componentFUJITSU LTD·Filed 2007·Granted Apr 7, 2009·13 cites·1 claims
- 0586US6437450B1Method of mounting semiconductor chipFUJITSU LTD·Filed 2000·Granted Aug 20, 2002·38 cites·4 claims
- 0685US9536857B1Heating header of semiconductor mounting apparatus and bonding method for semiconductorFUJITSU LTD·Filed 2016·Granted Jan 3, 2017·5 cites·5 claims
- 0785US8720519B2Electronic packaging apparatus and electronic packaging methodYAMAKAMI TAKATOYO·Filed 2011·Granted May 13, 2014·9 cites·7 claims
- 0885US7424966B2Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2005·Granted Sep 16, 2008·7 cites·4 claims
- 0985US6885522B1Head assembly having integrated circuit chip covered by layer which prevents foreign particle generationFUJITSU LTD·Filed 2000·Granted Apr 26, 2005·17 cites·12 claims
- 1084US7347347B2Head assembly, disk unit, and bonding method and apparatusFUJITSU LTD·Filed 2004·Granted Mar 25, 2008·15 cites·11 claims
- 1183US6483190B1Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting methodFUJITSU LTD·Filed 2000·Granted Nov 19, 2002·29 cites·2 claims
- 1278US9905528B2Semiconductor mounting apparatus, head thereof, and method for manufacturing laminated chipFUJITSU LTD·Filed 2016·Granted Feb 27, 2018·3 cites·8 claims
- 1377US9615464B2Method of mounting semiconductor element, and semiconductor deviceFUJITSU LTD·Filed 2013·Granted Apr 4, 2017·4 cites·12 claims
- 1476US10103126B2Laminated semiconductor device and manufacturing method of laminated semiconductor deviceFUJITSU LTD·Filed 2017·Granted Oct 16, 2018·2 cites·7 claims
- 1576US7566586B2Method of manufacturing a semiconductor deviceFUJITSU LTD·Filed 2006·Granted Jul 28, 2009·7 cites·11 claims
- 1675US6369985B1Head suspension, head assembly, and disk apparatus having a head IC mounted on a head suspension, and method for fitting a head IC to a head suspensionFUJITSU LTD·Filed 2000·Granted Apr 9, 2002·10 cites·17 claims
- 1774US7982295B2Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic deviceFUJITSU LTD·Filed 2009·Granted Jul 19, 2011·5 cites·9 claims
- 1874US7828193B2Method of mounting an electronic component and mounting apparatusFUJITSU LTD·Filed 2007·Granted Nov 9, 2010·6 cites·7 claims
- 1973US7562434B2Method of assembling a carriage assemblyFUJITSU LTD·Filed 2006·Granted Jul 21, 2009·6 cites·3 claims
- 2073US7355285B2Structure of mounting electronic componentFUJITSU LTD·Filed 2005·Granted Apr 8, 2008·4 cites·3 claims
- 2172US8861903B2Method of manufacturing optical waveguide device and optical waveguide deviceFUJITSU LTD·Filed 2012·Granted Oct 14, 2014·1 cites·15 claims
- 2272US6582993B1Method of underfilling semiconductor deviceFUJITSU LTD·Filed 2000·Granted Jun 24, 2003·17 cites·7 claims
- 2371US7960215B2Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic deviceFUJITSU LTD·Filed 2009·Granted Jun 14, 2011·4 cites·6 claims
- 2470US7350685B2Method of mounting electronic componentFUJITSU LTD·Filed 2005·Granted Apr 1, 2008·2 cites·7 claims
- 2570US7274296B2RFID tagFUJITSU FRONTECH LTD·Filed 2005·Granted Sep 25, 2007·4 cites·7 claims
- 2670US7196512B2Magnetic head testerFUJITSU LTD·Filed 2003·Granted Mar 27, 2007·8 cites·11 claims
- 2769US7506427B2Method of assembling a carriage assemblyFUJITSU LTD·Filed 2006·Granted Mar 24, 2009·1 cites·5 claims
- 2869US7208059B2Method of ultrasonic-mounting electronic component and ultrasonic mounting machineFUJITSU LTD·Filed 2005·Granted Apr 24, 2007·4 cites·6 claims
- 2967US7264146B2Ultrasonic tool and ultrasonic bonderFUJITSU LTD·Filed 2004·Granted Sep 4, 2007·9 cites·16 claims
- 3067US7214563B2IC chip mounting methodFUJITSU FRONTECH LTD·Filed 2005·Granted May 8, 2007·3 cites·12 claims
- 3167US6716665B2Method of mounting chip onto printed circuit board in shortened working timeFUJITSU LTD·Filed 2001·Granted Apr 6, 2004·13 cites·17 claims
- 3266US8169075B2Electronic part with affixed MEMSTAKAHASHI TETSUYA·Filed 2009·Granted May 1, 2012·3 cites·3 claims
- 3366US6770319B2Resin coating methodFUJITSU LTD·Filed 2001·Granted Aug 3, 2004·7 cites·12 claims
- 3465US7789316B2Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic deviceFUJITSU LTD·Filed 2009·Granted Sep 7, 2010·2 cites·6 claims
- 3565US7687314B2Electronic apparatus manufacturing methodFUJITSU LTD·Filed 2008·Granted Mar 30, 2010·2 cites·7 claims
- 3664US7902983B2RFID tagFUJITSU LTD·Filed 2008·Granted Mar 8, 2011·2 cites·8 claims
- 3764US7833831B2Method of manufacturing an electronic component and an electronic deviceFUJITSU LTD·Filed 2007·Granted Nov 16, 2010·2 cites·10 claims
- 3864US7581309B2Method of assembling a carriage assemblyFUJITSU LTD·Filed 2006·Granted Sep 1, 2009·3 cites·2 claims
- 3963US9793221B2Semiconductor device mounting methodFUJITSU LTD·Filed 2016·Granted Oct 17, 2017·1 cites·14 claims
- 4063US2009146653A1Slider testerFUJITSU LTD·Filed 2008·Application pending·0 cites
- 4162US7317395B2RFID tag and method of manufacturing the sameFUJITSU LTD·Filed 2005·Granted Jan 8, 2008·3 cites·8 claims
- 4262US6006426AMethod of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a boardFUJITSU LTD·Filed 1998·Granted Dec 28, 1999·21 cites·17 claims
- 4361US6177730B1Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chipFUJITSU LTD·Filed 1998·Granted Jan 23, 2001·22 cites·3 claims
- 4460US7595219B2IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the second roller on a traveling baseFUJITSU LTD·Filed 2006·Granted Sep 29, 2009·2 cites·2 claims
- 4560US7431218B2RFID tag, module component, and RFID tag fabrication methodFUJITSU LTD·Filed 2005·Granted Oct 7, 2008·1 cites·5 claims
- 4660US6240634B1Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a boardFUJITSU LTD·Filed 1999·Granted Jun 5, 2001·19 cites·17 claims
- 4759US7049217B2Method of forming multi-piled bumpFUJITSU LTD·Filed 2004·Granted May 23, 2006·8 cites·5 claims
- 4859US2008265002A1Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 4959US2008265003A1Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 5058US7394163B2Method of mounting semiconductor chipFUJITSU LTD·Filed 2002·Granted Jul 1, 2008·6 cites·2 claims
Showing the top 50 of 91 patent records by PatentIndex Score.
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