Inventor · disambiguated record
Amit P. Marathe
Also filed as: MARATHE AMIT · MARATHE AMIT P · MARATHE AMIT PRABHAKAR
58 granted patents·2 pending applications·975 citations·filing 1998–2022
99Inventor score
Files withADVANCED MICRO DEVICES INC53INSEEGO CORP2GLOBALFOUNDRIES INC1MICROSOFT TECHNOLOGY LICENSING LLC1SPANSION LLC1
Top patents by PatentIndex Score
60 records- 0197US7084062B1Use of Ta-capped metal line to improve formation of memory element filmsSPANSION LLC·Filed 2005·Granted Aug 1, 2006·46 cites·22 claims
- 0291US6822437B1Interconnect test structure with slotted feeder lines to prevent stress-induced voidsADVANCED MICRO DEVICES INC·Filed 2003·Granted Nov 23, 2004·53 cites·32 claims
- 0390US7451411B2Integrated circuit design systemADVANCED MICRO DEVICES INC·Filed 2006·Granted Nov 11, 2008·23 cites·20 claims
- 0489US6952052B1Cu interconnects with composite barrier layers for wafer-to-wafer uniformityADVANCED MICRO DEVICES INC·Filed 2004·Granted Oct 4, 2005·51 cites·11 claims
- 0588US7288782B1Use of Ta-capped metal line to improve formation of memory element filmsADVANCED MICRO DEVICES INC·Filed 2005·Granted Oct 30, 2007·14 cites·19 claims
- 0687US6433402B1Selective copper alloy depositionADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 13, 2002·47 cites·6 claims
- 0786US7310155B1Extraction of tool independent line-edge-roughness (LER) measurements using in-line programmed LER and reliability structuresADVANCED MICRO DEVICES INC·Filed 2004·Granted Dec 18, 2007·25 cites·16 claims
- 0886US6531777B1Barrier metal integrity testing using a dual level line to line leakage testing pattern and partial CMPADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 11, 2003·36 cites·20 claims
- 0985US6822473B1Determination of permeability of layer material within interconnectADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 23, 2004·28 cites·25 claims
- 1085US6599827B1Methods of forming capped copper interconnects with improved electromigration resistanceADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 29, 2003·41 cites·18 claims
- 1184US7755194B1Composite barrier layers with controlled copper interface surface roughnessADVANCED MICRO DEVICES INC·Filed 2006·Granted Jul 13, 2010·10 cites·10 claims
- 1284US6867056B1System and method for current-enhanced stress-migration testing of interconnectADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 15, 2005·31 cites·16 claims
- 1383US6498384B1Structure and method of semiconductor via testingADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 24, 2002·25 cites·8 claims
- 1483US6432822B1Method of improving electromigration resistance of capped CuADVANCED MICRO DEVICES INC·Filed 2001·Granted Aug 13, 2002·33 cites·11 claims
- 1582US6725433B1Method for assessing the reliability of interconnectsADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 20, 2004·26 cites·20 claims
- 1682US6506677B1Method of forming capped copper interconnects with reduced hillock formation and improved electromigration resistanceADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 14, 2003·34 cites·18 claims
- 1781US6762597B1Structure, system, and method for assessing electromigration permeability of layer material within interconnectADVANCED MICRO DEVICES INC·Filed 2002·Granted Jul 13, 2004·25 cites·26 claims
- 1881US6714037B1Methodology for an assessment of the degree of barrier permeability at via bottom during electromigration using dissimilar barrier thicknessADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 30, 2004·23 cites·33 claims
- 1979US6858511B1Method of semiconductor via testingADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 22, 2005·19 cites·10 claims
- 2078US6309959B1Formation of self-aligned passivation for interconnect to minimize electromigrationADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 30, 2001·28 cites·19 claims
- 2177US7155359B1Determination of device failure characteristicADVANCED MICRO DEVICES INC·Filed 2004·Granted Dec 26, 2006·20 cites·13 claims
- 2277US6727592B1Copper interconnect with improved barrier layerADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 27, 2004·23 cites·16 claims
- 2374US6590288B1Selective deposition in integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 8, 2003·16 cites·9 claims
- 2474US6531780B1Via formation in integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 11, 2003·20 cites·9 claims
- 2574US6426293B1Minimizing resistance and electromigration of interconnect by adjusting anneal temperature and amount of seed layer dopantADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 30, 2002·22 cites·28 claims
- 2672US6897476B1Test structure for determining electromigration and interlayer dielectric failureADVANCED MICRO DEVICES INC·Filed 2003·Granted May 24, 2005·15 cites·9 claims
- 2772US6825684B1Hot carrier oxide qualification methodADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 30, 2004·14 cites·9 claims
- 2871US7146588B1Predicting EM reliability by decoupling extrinsic and intrinsic sigmaADVANCED MICRO DEVICES INC·Filed 2004·Granted Dec 5, 2006·14 cites·23 claims
- 2970US7033940B1Method of forming composite barrier layers with controlled copper interface surface roughnessADVANCED MICRO DEVICES INC·Filed 2004·Granted Apr 25, 2006·13 cites·8 claims
- 3070US6417566B1Void eliminating seed layer and conductor core integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 9, 2002·16 cites·9 claims
- 3169US7340360B1Method for determining projected lifetime of semiconductor devices with analytical extension of stress voltage window by scaling of oxide thicknessADVANCED MICRO DEVICES INC·Filed 2006·Granted Mar 4, 2008·7 cites·16 claims
- 3267US2023010481A1Systems and methods for monitoring and detecting symptoms of infectious conditionsINSEEGO CORP·Filed 2022·Application pending·0 cites
- 3365US7379924B1Quantifying and predicting the impact of line edge roughness on device reliability and performanceADVANCED MICRO DEVICES INC·Filed 2004·Granted May 27, 2008·9 cites·9 claims
- 3465US6717266B1Use of an alloying element to form a stable oxide layer on the surface of metal featuresADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 6, 2004·12 cites·8 claims
- 3564US11490812B2Systems and methods for monitoring and detecting symptoms of infectious conditionsINSEEGO CORP·Filed 2020·Granted Nov 8, 2022·0 cites·19 claims
- 3663US8022716B2Dielectric breakdown lifetime enhancement using alternating current (AC) capacitanceGLOBALFOUNDRIES INC·Filed 2009·Granted Sep 20, 2011·4 cites·19 claims
- 3763US6770847B2Method and system for Joule heating characterizationADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 3, 2004·10 cites·20 claims
- 3863US6621290B1Characterization of barrier layers in integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 16, 2003·8 cites·16 claims
- 3961US6939803B2Method for forming conductor reservoir volume for integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 6, 2005·8 cites·6 claims
- 4061US6498397B1Seed layer with annealed region for integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 24, 2002·8 cites·8 claims
- 4161US6075293ASemiconductor device having a multi-layer metal interconnect structureADVANCED MICRO DEVICES INC·Filed 1999·Granted Jun 13, 2000·26 cites·20 claims
- 4260US6462417B1Coherent alloy diffusion barrier for integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 8, 2002·9 cites·18 claims
- 4359US6649034B1Electro-chemical metal alloying for semiconductor manufacturingADVANCED MICRO DEVICES INC·Filed 2001·Granted Nov 18, 2003·2 cites·20 claims
- 4459US6649511B1Method of manufacturing a seed layer with annealed region for integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 18, 2003·7 cites·10 claims
- 4559US6472757B2Conductor reservoir volume for integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 29, 2002·7 cites·6 claims
- 4658US7026225B1Semiconductor component and method for precluding stress-induced void formation in the semiconductor componentADVANCED MICRO DEVICES INC·Filed 2003·Granted Apr 11, 2006·8 cites·18 claims
- 4758US6445070B1Coherent carbide diffusion barrier for integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 3, 2002·10 cites·27 claims
- 4854US6599835B1Testing dielectric and barrier layers for integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 29, 2003·6 cites·12 claims
- 4953US6518185B1Integration scheme for non-feature-size dependent cu-alloy introductionADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 11, 2003·5 cites·12 claims
- 5053US6462416B1Gradated barrier layer in integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 8, 2002·5 cites·10 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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