Inventor · disambiguated record
Jagdish G. Belani
Also filed as: BELANI JAGDISH · BELANI JAGDISH G
10 granted patents·834 citations·filing 1982–1996
93Inventor score
Files withNAT SEMICONDUCTOR CORP10
Top patents by PatentIndex Score
10 records- 0195US5620928AUltra thin ball grid array using a flex tape or printed wiring board substrate and methodNAT SEMICONDUCTOR CORP·Filed 1995·Granted Apr 15, 1997·119 cites·21 claims
- 0295US4912548AUse of a heat pipe integrated with the IC package for improving thermal performanceNAT SEMICONDUCTOR CORP·Filed 1988·Granted Mar 27, 1990·216 cites·3 claims
- 0394US5650659ASemiconductor component package assembly including an integral RF/EMI shieldNAT SEMICONDUCTOR CORP·Filed 1995·Granted Jul 22, 1997·205 cites·14 claims
- 0490US4411735APolymeric insulation layer etching process and compositionNAT SEMICONDUCTOR CORP·Filed 1982·Granted Oct 25, 1983·85 cites·17 claims
- 0585US5705851AThermal ball lead integrated packageNAT SEMICONDUCTOR CORP·Filed 1995·Granted Jan 6, 1998·92 cites·11 claims
- 0679US5644167AIntegrated circuit package assemblies including an electrostatic discharge interposerNAT SEMICONDUCTOR CORP·Filed 1996·Granted Jul 1, 1997·60 cites·19 claims
- 0774US4595480ASystem for electroplating molded semiconductor devicesNAT SEMICONDUCTOR CORP·Filed 1985·Granted Jun 17, 1986·20 cites·10 claims
- 0845US4486511ASolder composition for thin coatingsNAT SEMICONDUCTOR CORP·Filed 1983·Granted Dec 4, 1984·13 cites·5 claims
- 0944US5046657ATape automated bonding of bumped tape on bumped dieNAT SEMICONDUCTOR CORP·Filed 1990·Granted Sep 10, 1991·17 cites·15 claims
- 1034US4876587AOne-piece interconnection package and processNAT SEMICONDUCTOR CORP·Filed 1987·Granted Oct 24, 1989·7 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →