Inventor · disambiguated record
Josef Heitzer
Also filed as: HEITZER JOSEF
8 granted patents·1 pending application·243 citations·filing 1998–2004
89Inventor score
Top patents by PatentIndex Score
9 records- 0182US6288904B1Chip module, in particular for implantation in a smart card bodyINFINEON TECHNOLOGIES AG·Filed 1999·Granted Sep 11, 2001·67 cites·17 claims
- 0270US6191951B1Smart card module and smart card including a smart card moduleINFINEON TECHNOLOGIES AG·Filed 1999·Granted Feb 20, 2001·39 cites·12 claims
- 0366US6313524B1Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrateINFINEON TECHNOLOGIES AG·Filed 1999·Granted Nov 6, 2001·34 cites·14 claims
- 0466US6185507B1Microprocessor, in particular for use in a chip card, with a control unit and with a housing surrounding the control unitSIEMENS AG·Filed 1999·Granted Feb 6, 2001·33 cites·7 claims
- 0559US6088901AMethod for producing a carrier element for semiconductor chipsSIEMENS AG·Filed 1998·Granted Jul 18, 2000·24 cites·9 claims
- 0657US6719205B1Carrier element for a semiconductor chip for incorporation into smart cardsINFINEON TECHNOLOGIES AG·Filed 1999·Granted Apr 13, 2004·17 cites·13 claims
- 0757US5874354AMethod for electrically connecting a semiconductor chip to at least one contact surface and smart card module and smart card produced by the methodSIEMENS AG·Filed 1998·Granted Feb 23, 1999·23 cites·2 claims
- 0856US6806562B2Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the twoINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 19, 2004·6 cites·14 claims
- 0937US2004256150A1Nonconducting substrate, forming a strip or a panel, on which a multiplicity of carrier elements are formedINFINEON TECHNOLOGIES AG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →