Inventor · disambiguated record
Chien-Hsin Ho
Also filed as: HO CHIEN-HSIN
5 granted patents·4 pending applications·5 citations·filing 2012–2025
70Inventor score
Top patents by PatentIndex Score
9 records- 0181US2025279315A1Interconnect structure without barrier layer on bottom surface of viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0280US8749060B2Method of semiconductor integrated circuit fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jun 10, 2014·4 cites·20 claims
- 0375US12308282B2Interconnect structure without barrier layer on bottom surface of viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 0472US10453740B2Interconnect structure without barrier layer on bottom surface of viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 22, 2019·1 cites·20 claims
- 0562US11322391B2Interconnect structure without barrier layer on bottom surface of viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 3, 2022·0 cites·20 claims
- 0656US2025054810A1Semiconductor structure including cap layer of two-dimensional material and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0755US9842767B2Method of forming an interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 12, 2017·0 cites·20 claims
- 0855US2025113499A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0954US2024088042A1Semiconductor structures and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →