Inventor · disambiguated record

Yueh-Ching Chang

Also filed as: CHANG YUEH-CHING

2 granted patents·0 citations·filing 2012–2015

27Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD1 TSAI TSUNG-HAN1

Top patents by PatentIndex Score

2 records

0145US9711468B2Bonding pad structure with dense via arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 18, 2017·0 cites·20 claims
0245US9041204B2Bonding pad structure with dense via arrayTSAI TSUNG-HAN·Filed 2012·Granted May 26, 2015·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →