Inventor · disambiguated record
Murugasan Manikam Achari
Also filed as: ACHARI MURUGASAN MANIKAM
4 granted patents·4 citations·filing 2006–2010
62Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0163US7759171B2Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor packageSPANSION LLC·Filed 2007·Granted Jul 20, 2010·4 cites·14 claims
- 0252US7846771B2Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devicesSPANSION LLC·Filed 2008·Granted Dec 7, 2010·0 cites·2 claims
- 0347US7414305B2Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devicesSPANSION LLC·Filed 2006·Granted Aug 19, 2008·0 cites·15 claims
- 0433US8546936B2Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor packageHUSSIN PAKHORUDIN·Filed 2010·Granted Oct 1, 2013·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →