Inventor · disambiguated record
Nyles Nettleton
Also filed as: NETTLETON NYLES · NETTLETON NYLES I
8 granted patents·7 pending applications·284 citations·filing 2000–2020
89Inventor score
Files withSUN MICROSYSTEMS INC5ORACLE INT CORP2DAYRINGER MICHAEL H S1GUENIN BRUCE M1ISOTHERMAL SYSTEMS RES INC1
Top patents by PatentIndex Score
15 records- 0197US7372698B1Electronics equipment heat exchanger systemISOTHERMAL SYSTEMS RES INC·Filed 2006·Granted May 13, 2008·88 cites·20 claims
- 0292US6631439B2VLIW computer processing architecture with on-chip dynamic RAMSUN MICROSYSTEMS INC·Filed 2001·Granted Oct 7, 2003·98 cites·37 claims
- 0391US7425760B1Multi-chip module structure with power delivery using flexible cablesSUN MICROSYSTEMS INC·Filed 2005·Granted Sep 16, 2008·27 cites·20 claims
- 0483US6619858B1Optical interconnectSUN MICROSYSTEMS INC·Filed 2000·Granted Sep 16, 2003·39 cites·63 claims
- 0574US8164917B2Base plate for use in a multi-chip moduleSHI JING·Filed 2009·Granted Apr 24, 2012·7 cites·20 claims
- 0667US9082632B2Ramp-stack chip package with variable chip spacingDAYRINGER MICHAEL H S·Filed 2012·Granted Jul 14, 2015·4 cites·19 claims
- 0766US7080234B2VLIW computer processing architecture having the problem counter stored in a register file registerSUN MICROSYSTEMS INC·Filed 2001·Granted Jul 18, 2006·12 cites·30 claims
- 0863US7043596B2Method and apparatus for simulation processorSUN MICROSYSTEMS INC·Filed 2002·Granted May 9, 2006·9 cites·63 claims
- 0957US2020357772A1Method and apparatus for stacking warped chips to assemble three-dimensional integrated circuitsORACLE INT CORP·Filed 2020·Application pending·0 cites
- 1048US2019279962A1Method and apparatus for stacking warped chips to assemble three-dimensional integrated circuitsORACLE INT CORP·Filed 2018·Application pending·0 cites
- 1147US2009002947A1Evaporative cooling system for electronic componentsXCELAERO CORP·Filed 2008·Application pending·0 cites
- 1241US2006095639A1Structures and methods for proximity communication using bridge chipsGUENIN BRUCE M·Filed 2005·Application pending·0 cites
- 1340US2002032710A1Processing architecture having a matrix-transpose capabilityFiled 2001·Application pending·0 cites
- 1440US2002087821A1VLIW computer processing architecture with on-chip DRAM usable as physical memory or cache memoryFiled 2001·Application pending·0 cites
- 1539US2003082092A1Carbon nanoloopFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →