Inventor · disambiguated record
Mie Matsuo
Also filed as: MATSUO MIE
58 granted patents·14 pending applications·1,953 citations·filing 1993–2025
99Inventor score
Top patents by PatentIndex Score
72 records- 0199US6809421B1Multichip semiconductor device, chip therefor and method of formation thereofTOSHIBA KK·Filed 1999·Granted Oct 26, 2004·496 cites·16 claims
- 0298US7053456B2Electronic component having micro-electrical mechanical systemTOSHIBA KK·Filed 2004·Granted May 30, 2006·150 cites·16 claims
- 0397US7235456B2Method of making empty space in siliconTOSHIBA KK·Filed 2006·Granted Jun 26, 2007·38 cites·26 claims
- 0496US7507634B2Method for fabricating a localize SOI in bulk silicon substrate including changing first trenches formed in the substrate into unclosed empty space by applying heat treatmentTOSHIBA KK·Filed 2007·Granted Mar 24, 2009·28 cites·7 claims
- 0596US7427797B2Semiconductor device having actuatorTOSHIBA KK·Filed 2005·Granted Sep 23, 2008·50 cites·15 claims
- 0695US7019364B1Semiconductor substrate having pillars within a closed empty spaceTOSHIBA KK·Filed 2000·Granted Mar 28, 2006·74 cites·12 claims
- 0794US7829975B2Multichip semiconductor device, chip therefor and method of formation thereofTOSHIBA KK·Filed 2007·Granted Nov 9, 2010·23 cites·5 claims
- 0894US6717251B2Stacked type semiconductor deviceTOSHIBA KK·Filed 2001·Granted Apr 6, 2004·103 cites·26 claims
- 0993US10892269B2Semiconductor memory device having a bonded circuit chip including a solid state drive controller connected to a control circuitTOSHIBA MEMORY CORP·Filed 2019·Granted Jan 12, 2021·6 cites·15 claims
- 1093US8283755B2Multichip semiconductor device, chip therefor and method of formation thereofHAYASAKA NOBUO·Filed 2011·Granted Oct 9, 2012·15 cites·8 claims
- 1193US6791175B2Stacked type semiconductor deviceTOSHIBA KK·Filed 2002·Granted Sep 14, 2004·74 cites·18 claims
- 1293US5731634ASemiconductor device having a metal film formed in a groove in an insulating filmTOSHIBA KK·Filed 1996·Granted Mar 24, 1998·102 cites·14 claims
- 1392US6504227B1Passive semiconductor device mounted as daughter chip on active semiconductor deviceTOSHIBA KK·Filed 2000·Granted Jan 7, 2003·91 cites·12 claims
- 1492US5775980APolishing method and polishing apparatusTOSHIBA KK·Filed 1996·Granted Jul 7, 1998·105 cites·8 claims
- 1592US2025393215A1Semiconductor memory deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 1691US7808064B2Semiconductor package including through-hole electrode and light-transmitting substrateTOSHIBA KK·Filed 2009·Granted Oct 5, 2010·26 cites·18 claims
- 1791US5607718APolishing method and polishing apparatusTOSHIBA KK·Filed 1994·Granted Mar 4, 1997·119 cites·29 claims
- 1890US8174093B2Multichip semiconductor device, chip therefor and method of formation thereofHAYASAKA NOBUO·Filed 2010·Granted May 8, 2012·10 cites·16 claims
- 1989US6734568B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted May 11, 2004·55 cites·22 claims
- 2087US7869240B2Semiconductor device and semiconductor memory testerTOSHIBA KK·Filed 2008·Granted Jan 11, 2011·12 cites·8 claims
- 2186US11579796B2Memory systemKIOXIA CORP·Filed 2021·Granted Feb 14, 2023·2 cites·16 claims
- 2286US8098312B2Back-illuminated type solid-state image pickup apparatus with peripheral circuit unitMATSUO MIE·Filed 2009·Granted Jan 17, 2012·11 cites·17 claims
- 2386US6709966B1Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming deviceTOSHIBA KK·Filed 2000·Granted Mar 23, 2004·38 cites·8 claims
- 2485US12419055B2Semiconductor memory device having a circuit chip bonded to a memory array chip and including a solid-state drive controller and a control circuitKIOXIA CORP·Filed 2023·Granted Sep 16, 2025·0 cites·2 claims
- 2584US7238919B2Heating element movement bonding method for semiconductor componentsTOSHIBA KK·Filed 2006·Granted Jul 3, 2007·13 cites·13 claims
- 2684US6991964B2Stacked type semiconductor deviceTOSHIBA KK·Filed 2004·Granted Jan 31, 2006·30 cites·6 claims
- 2782US7177134B2Variable-capacitance element, variable-capacitance device, and portable phone including variable-capacitance deviceTOSHIBA KK·Filed 2005·Granted Feb 13, 2007·12 cites·20 claims
- 2882US5424246AMethod of manufacturing semiconductor metal wiring layer by reduction of metal oxideTOSHIBA KK·Filed 1993·Granted Jun 13, 1995·52 cites·8 claims
- 2981US8179730B2Semiconductor device and semiconductor memory testerSHIMIZU YUUI·Filed 2010·Granted May 15, 2012·5 cites·10 claims
- 3081US5561082AMethod for forming an electrode and/or wiring layer by reducing copper oxide or silver oxideTOSHIBA KK·Filed 1995·Granted Oct 1, 1996·44 cites·26 claims
- 3180US8228426B2Semiconductor package and camera moduleMATSUO MIE·Filed 2009·Granted Jul 24, 2012·10 cites·15 claims
- 3279US6812557B2Stacked type semiconductor deviceTOSHIBA KK·Filed 2003·Granted Nov 2, 2004·28 cites·20 claims
- 3378US12148666B2Semiconductor device, method of manufacturing semiconductor device, and method of recycling substrateKIOXIA CORP·Filed 2023·Granted Nov 19, 2024·0 cites·16 claims
- 3478US7335517B2Multichip semiconductor device, chip therefor and method of formation thereofTOSHIBA KK·Filed 2004·Granted Feb 26, 2008·17 cites·13 claims
- 3576US11355441B2Semiconductor deviceTOSHIBA KK·Filed 2019·Granted Jun 7, 2022·4 cites·17 claims
- 3676US11101167B2Semiconductor device manufacturing method and semiconductor deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Aug 24, 2021·1 cites·18 claims
- 3774US7095112B2Semiconductor device, semiconductor package member, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2003·Granted Aug 22, 2006·20 cites·15 claims
- 3873US7531876B2Semiconductor device having power semiconductor elementsTOSHIBA KK·Filed 2005·Granted May 12, 2009·6 cites·14 claims
- 3973US7402903B2Semiconductor deviceTOSHIBA KK·Filed 2004·Granted Jul 22, 2008·18 cites·22 claims
- 4072US11871576B2Semiconductor memory device including integrated control circuit and solid-state drive controllerKIOXIA CORP·Filed 2020·Granted Jan 9, 2024·0 cites·15 claims
- 4171US11862510B2Semiconductor device manufacturing method and semiconductor deviceKIOXIA CORP·Filed 2021·Granted Jan 2, 2024·0 cites·10 claims
- 4271US7608537B2Method for fabricating semiconductor deviceTOSHIBA KK·Filed 2007·Granted Oct 27, 2009·3 cites·20 claims
- 4370US8837871B2Optical waveguide sensor chip, optical waveguide sensor, and method for manufacturing optical waveguide sensor chipFUJII MIKA·Filed 2011·Granted Sep 16, 2014·3 cites·18 claims
- 4470US8748316B2Method of manufacturing semiconductor device, semiconductor device, and camera moduleSHIRONO TAKASHI·Filed 2011·Granted Jun 10, 2014·1 cites·7 claims
- 4569US7859073B2Back-illuminated type solid-state image pickup device and camera module using the sameTOSHIBA KK·Filed 2008·Granted Dec 28, 2010·4 cites·8 claims
- 4669US6614106B2Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit deviceTOSHIBA KK·Filed 2001·Granted Sep 2, 2003·15 cites·17 claims
- 4768US7482194B2Electronic component having micro-electrical mechanical systemTOSHIBA KK·Filed 2006·Granted Jan 27, 2009·3 cites·9 claims
- 4868US7067897B2Semiconductor deviceTOSHIBA KK·Filed 2003·Granted Jun 27, 2006·14 cites·20 claims
- 4967US11652000B2Semiconductor device, method of manufacturing semiconductor device, and method of recycling substrateKIOXIA CORP·Filed 2021·Granted May 16, 2023·0 cites·14 claims
- 5067US9633902B2Method for manufacturing semiconductor device that includes dividing semiconductor substrate by dry etchingTOSHIBA KK·Filed 2015·Granted Apr 25, 2017·1 cites·20 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →