Inventor · disambiguated record

Ming-Kai Liu

Also filed as: LIU MING · LIU MING-KAI

50 granted patents·3 pending applications·144 citations·filing 2009–2024

97Inventor score

Technology areasH10W H10P H10F

Files withTAIWAN SEMICONDUCTOR MFG CO LTD42 TAIWAN SEMICONDUCTOR MFG6 LIU MING-KAI2 AAC ACOUSTIC TECHNOLOGIES SHEN1 LIANG SHIH-WEI1

Top patents by PatentIndex Score

53 records

0197US9412661B2Method for forming package-on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 9, 2016·50 cites·12 claims
0294US11929319B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
0394US9543373B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·15 cites·20 claims
0490US10043761B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 7, 2018·5 cites·20 claims
0589US11335666B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·16 claims
0688US8901730B2Methods and apparatus for package on package devicesLIU MING-KAI·Filed 2012·Granted Dec 2, 2014·9 cites·20 claims
0787US8994176B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 31, 2015·6 cites·20 claims
0886US10163824B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·4 cites·15 claims
0986US9806045B2Interconnection structure including a metal post encapsulated by solder joint having a concave outer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 31, 2017·6 cites·20 claims
1084US9653417B2Method for singulating packaged integrated circuits and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 16, 2017·5 cites·20 claims
1183US12205888B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
1282US11075159B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·2 cites·20 claims
1382US10157900B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·3 cites·20 claims
1482US9543263B2Semiconductor packaging and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·4 cites·20 claims
1582US2024387359A1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1681US10879170B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·3 cites·20 claims
1781US9559071B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·18 claims
1881US8557626B2Image sensor devices and methods for manufacturing the sameLIU MING-KAI·Filed 2010·Granted Oct 15, 2013·3 cites·10 claims
1979US10269640B2Method for singulating packaged integrated circuits and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
2078US11101238B2Surface mounting semiconductor componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·2 cites·20 claims
2178US9373599B2Methods and apparatus for package on package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 21, 2016·3 cites·20 claims
2278US2024387454A1Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2377US10510681B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
2476US10504865B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·2 cites·20 claims
2575US9331023B1Device packagingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 3, 2016·3 cites·20 claims
2674US12148735B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
2774US9064873B2Singulated semiconductor structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 23, 2015·3 cites·20 claims
2871US9953942B2Semiconductor packaging and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 24, 2018·1 cites·20 claims
2970US11894330B2Methods of manufacturing a semiconductor device including a joint adjacent to a postTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
3069US9391012B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 12, 2016·1 cites·20 claims
3169US8941202B2Image sensor devices and methods for manufacturing the sameVISERA TECHNOLOGIES CO LTD·Filed 2013·Granted Jan 27, 2015·0 cites·9 claims
3267US11211339B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
3364US9941240B2Semiconductor chip scale package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 10, 2018·1 cites·18 claims
3464US9460989B2Interposer having a defined through via patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 4, 2016·1 cites·20 claims
3562US8664768B2Interposer having a defined through via patternLIANG SHIH-WEI·Filed 2012·Granted Mar 4, 2014·1 cites·20 claims
3661US10964595B2Method for singulating packaged integrated circuits and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
3759USRE49046EMethods and apparatus for package on package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 19, 2022·0 cites·38 claims
3859US10867957B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
3959US10312209B2Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 4, 2019·0 cites·20 claims
4058US11127708B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
4158US10304790B2Method of fabricating an integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 28, 2019·0 cites·20 claims
4257US12400936B2Stacked memory cube with integrated thermal path for enhanced heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
4356US10971463B2Interconnection structure including a metal post encapsulated by a joint material having concave outer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 6, 2021·0 cites·20 claims
4456US9472523B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 18, 2016·0 cites·19 claims
4555US10163846B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
4654US10037959B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·0 cites·20 claims
4752US9355924B2Integrated circuit underfill schemeTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 31, 2016·0 cites·14 claims
4850US11551999B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 10, 2023·0 cites·16 claims
4949US10269588B2Integrated circuit underfill schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·0 cites·20 claims
5047US9484308B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·0 cites·20 claims

Showing the top 50 of 53 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →